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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-322-41-005101

110-83-322-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2243 1.22
- +

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Немедленный

110-83-322-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-422-41-005101

110-83-422-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3890 1.22
- +

Добавить

Немедленный

110-83-422-41-005101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-422-41-605101

110-83-422-41-605101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2721 1.22
- +

Добавить

Немедленный

110-83-422-41-605101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-87-228-10-001101

410-87-228-10-001101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip

3936 1.25
- +

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Немедленный

410-87-228-10-001101

Datenblatt

Bulk 410 Active Zig-Zag, Left Stackable 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-87-228-10-002101

410-87-228-10-002101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip

3515 1.25
- +

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Немедленный

410-87-228-10-002101

Datenblatt

Bulk 410 Active Zig-Zag, Right Stackable 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-328-41-134191

114-87-328-41-134191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3766 1.25
- +

Добавить

Немедленный

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-628-41-001101

115-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2287 1.22
- +

Добавить

Немедленный

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-318-41-001101

614-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2134 1.27
- +

Добавить

Немедленный

614-83-318-41-001101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-105191

110-83-314-41-105191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3812 1.26
- +

Добавить

Немедленный

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-012101

116-83-314-41-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2657 1.23
- +

Добавить

Немедленный

116-83-314-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-004101

116-87-310-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3847 1.23
- +

Добавить

Немедленный

116-87-310-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-432-41-001101

115-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3267 1.23
- +

Добавить

Немедленный

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-624-41-001101

110-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2791 1.24
- +

Добавить

Немедленный

110-83-624-41-001101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-624-41-001151

110-83-624-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2155 1.24
- +

Добавить

Немедленный

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-105191

110-87-320-41-105191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2403 1.27
- +

Добавить

Немедленный

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-316-41-134191

114-83-316-41-134191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3549 1.28
- +

Добавить

Немедленный

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-008101

116-83-312-41-008101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2536 1.24
- +

Добавить

Немедленный

116-83-312-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-012101

116-87-318-41-012101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2034 1.24
- +

Добавить

Немедленный

116-87-318-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-3518-11

06-3518-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2562 1.34
- +

Добавить

Немедленный

06-3518-11

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0513-11H

04-0513-11H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2709 1.34
- +

Добавить

Немедленный

04-0513-11H

Datenblatt

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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