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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
09-0518-10H

09-0518-10H

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3859 1.34
- +

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Немедленный

09-0518-10H

Datenblatt

Bulk 518 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-87-424-41-105101

110-87-424-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3166 1.41
- +

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Немедленный

110-87-424-41-105101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-624-41-105101

110-87-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2254 1.24
- +

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Немедленный

110-87-624-41-105101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-624-41-001101

614-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3772 1.24
- +

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Немедленный

614-87-624-41-001101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-422-41-001101

115-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2098 1.24
- +

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Немедленный

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-322-41-001101

115-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3173 1.24
- +

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Немедленный

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-011101

116-87-312-41-011101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3573 1.29
- +

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Немедленный

116-87-312-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-316-31-012101

614-83-316-31-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2347 1.25
- +

Добавить

Немедленный

614-83-316-31-012101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-002101

116-87-316-41-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3015 1.29
- +

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Немедленный

116-87-316-41-002101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-013101

116-83-306-41-013101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2033 1.29
- +

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Немедленный

116-83-306-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-018101

116-83-316-41-018101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3121 1.25
- +

Добавить

Немедленный

116-83-316-41-018101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-003101

116-87-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3504 1.42
- +

Добавить

Немедленный

116-87-420-41-003101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-018101

116-87-322-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2159 1.26
- +

Добавить

Немедленный

116-87-322-41-018101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-01-762101

110-83-328-01-762101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2284 1.26
- +

Добавить

Немедленный

110-83-328-01-762101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-310-41-002101

124-83-310-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2940 1.26
- +

Добавить

Немедленный

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-006101

116-87-420-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3849 1.26
- +

Добавить

Немедленный

116-87-420-41-006101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-308-11-001101

299-87-308-11-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2423 1.40
- +

Добавить

Немедленный

299-87-308-11-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICF-308-TM-O-TR

ICF-308-TM-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2570 1.34
- +

Добавить

Немедленный

Tape & Reel (TR) iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
146-87-316-41-035101

146-87-316-41-035101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3583 1.27
- +

Добавить

Немедленный

146-87-316-41-035101

Datenblatt

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-316-41-036101

146-87-316-41-036101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2202 1.27
- +

Добавить

Немедленный

146-87-316-41-036101

Datenblatt

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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