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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
917-87-210-41-053101

917-87-210-41-053101

CONN TRANSIST TO-5 10POS GOLD

Preci-Dip

3889 1.15
- +

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Немедленный

917-87-210-41-053101

Datenblatt

Bulk 917 Active Transistor, TO-5 10 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-009101

116-83-610-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2941 1.12
- +

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Немедленный

116-83-610-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-306-11-001101

299-83-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3039 1.25
- +

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Немедленный

299-83-306-11-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-001101

116-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2372 1.12
- +

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Немедленный

116-87-312-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-328-41-117101

114-87-328-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2744 1.13
- +

Добавить

Немедленный

114-87-328-41-117101

Datenblatt

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-428-41-117101

114-87-428-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2604 1.16
- +

Добавить

Немедленный

114-87-428-41-117101

Datenblatt

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-008101

116-87-314-41-008101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2785 1.17
- +

Добавить

Немедленный

116-87-314-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-320-41-117101

114-83-320-41-117101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2116 1.17
- +

Добавить

Немедленный

114-83-320-41-117101

Datenblatt

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-320-41-134161

114-83-320-41-134161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2225 1.17
- +

Добавить

Немедленный

114-83-320-41-134161

Datenblatt

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-420-41-001101

115-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2777 1.13
- +

Добавить

Немедленный

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-105191

110-87-318-41-105191

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3209 1.17
- +

Добавить

Немедленный

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-318-41-134191

114-87-318-41-134191

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3712 1.17
- +

Добавить

Немедленный

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-430-41-005101

117-87-430-41-005101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

2937 1.13
- +

Добавить

Немедленный

117-87-430-41-005101

Datenblatt

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-620-41-005101

117-83-620-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3545 1.13
- +

Добавить

Немедленный

117-83-620-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
A-CCS 052-Z-SM

A-CCS 052-Z-SM

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components

2917 1.22
- +

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Немедленный

A-CCS 052-Z-SM

Datenblatt

Tube - Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled
116-87-610-41-009101

116-87-610-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3948 1.14
- +

Добавить

Немедленный

116-87-610-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
506-AG11D-ESL

506-AG11D-ESL

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

2988 1.23
- +

Добавить

Немедленный

506-AG11D-ESL

Datenblatt

Tube 500 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Copper Alloy Polyester
612-87-322-41-001101

612-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3099 1.14
- +

Добавить

Немедленный

612-87-322-41-001101

Datenblatt

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-422-41-105101

110-87-422-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2529 1.29
- +

Добавить

Немедленный

110-87-422-41-105101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-2513-10T

06-2513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3349 1.23
- +

Добавить

Немедленный

06-2513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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