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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-1518-11

06-1518-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2014 1.12
- +

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Немедленный

06-1518-11

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-314-41-007101

116-87-314-41-007101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3109 1.08
- +

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Немедленный

116-87-314-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-002101

116-83-610-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3502 1.04
- +

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Немедленный

116-83-610-41-002101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-328-41-001101

115-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2183 1.04
- +

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Немедленный

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-025-05-000101

510-83-025-05-000101

CONN SOCKET PGA 25POS GOLD

Preci-Dip

2407 1.05
- +

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Немедленный

510-83-025-05-000101

Datenblatt

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-032-24-008

540-88-032-24-008

CONN SOCKET PLCC 32POS TIN

Preci-Dip

3490 1.05
- +

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Немедленный

540-88-032-24-008

Datenblatt

Bulk 540 Active PLCC 32 (4 x 8) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
115-83-318-41-003101

115-83-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2226 1.09
- +

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Немедленный

115-83-318-41-003101

Datenblatt

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-012101

116-83-312-41-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2659 1.05
- +

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Немедленный

116-83-312-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-018101

116-83-314-41-018101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2619 1.06
- +

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Немедленный

116-83-314-41-018101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-428-41-005101

117-87-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3117 1.06
- +

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Немедленный

117-87-428-41-005101

Datenblatt

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-028-24-008

540-88-028-24-008

CONN SOCKET PLCC 28POS TIN

Preci-Dip

3729 1.06
- +

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Немедленный

540-88-028-24-008

Datenblatt

Bulk 540 Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-83-210-41-003101

116-83-210-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3295 1.10
- +

Добавить

Немедленный

116-83-210-41-003101

Datenblatt

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-605101

110-87-632-41-605101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3287 1.20
- +

Добавить

Немедленный

110-87-632-41-605101

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-432-41-005101

110-87-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2549 1.06
- +

Добавить

Немедленный

110-87-432-41-005101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-005101

110-87-632-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2884 1.20
- +

Добавить

Немедленный

110-87-632-41-005101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-0513-11

04-0513-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2774 1.15
- +

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Немедленный

04-0513-11

Datenblatt

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0513-10T

07-0513-10T

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3218 1.15
- +

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Немедленный

07-0513-10T

Datenblatt

Bulk 0513 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-10T

08-0518-10T

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3767 1.15
- +

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Немедленный

08-0518-10T

Datenblatt

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-10T

08-1518-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3182 1.15
- +

Добавить

Немедленный

08-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0518-10

09-0518-10

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2610 1.15
- +

Добавить

Немедленный

09-0518-10

Datenblatt

Bulk 518 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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