Sockets for ICs, Transistors - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
324-PRS18001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3673	136.12	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
262-PLS20003-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3838	136.84	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
262-PRS20003-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2171	136.84	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
40-6551-18 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	3341	140.30	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
40-6552-18 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2191	140.30	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
40-6553-18 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics	2933	140.30	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
40-3554-18 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	2092	140.30	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
32-3575-18 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	3659	141.21	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled
32-6575-18 CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics	2019	141.21	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
200-6325-9UN-1900 CONN SOCKET PGA ZIF 625POS GOLD 3M	3121	141.98	- + Добавить Немедленный	Datenblatt	Bulk	Textool™	Obsolete	PGA, ZIF (ZIP)	625 (25 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)
361-PLS19001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3545	142.65	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
300-PLS20006-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2365	143.34	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
300-PRS20006-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3187	143.34	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
299-PLS20009-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2842	143.51	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
299-PRS20009-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2650	143.51	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
28-6554-18 CONN IC DIP SOCKET ZIF 28POS Aries Electronics	2723	145.94	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
336-PLS20019-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3665	146.56	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
336-PLS20021-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2157	146.56	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
336-PRS20019-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3788	146.56	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
336-PRS20021-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2470	146.56	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)