Sockets for ICs, Transistors - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
256-PRS16001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2923	116.84	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
32-3551-18 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	3954	118.06	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
32-3552-18 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	3002	118.06	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
32-3553-18 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	3145	118.06	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
32-6554-18 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	2719	118.06	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
48-6571-18 CONN IC DIP SOCKET ZIF 48POS Aries Electronics	2161	119.13	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
162-PLS20020-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2646	119.26	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
162-PRS20020-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2750	119.26	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
164-PRS21013-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3810	119.73	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
244-5205-00 3M TEXTOOL OPEN-TOP SOCKETS FOR 3M	2802	120.29	- + Добавить Немедленный		Box	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
256-5205-01 3M TEXTOOL 256-5205-01 QFN .5 MM 3M	2578	120.35	- + Добавить Немедленный		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
268-4204-00 3M TEXTOOL 268-4204-00 QFN.4 MM 3M	2484	120.67	- + Добавить Немедленный		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
28-3574-18 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	2686	120.70	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-6572-18 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3979	120.70	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-6573-18 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3837	120.70	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-6574-18 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3247	120.70	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
260-5204-01 CONN SOCKET QFN 60POS GOLD 3M	2726	121.35	- + Добавить Немедленный	Datenblatt	Bulk	Textool™	Active	QFN	60 (4 x 15)	0.020 (0.50mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.020 (0.50mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)
223-PLS18017-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3887	121.82	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
223-PLS18039-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3259	121.82	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
223-PRS18017-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2634	121.82	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)