Sockets for ICs, Transistors - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
223-PRS18039-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3394	121.82	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
225-PLS18003-12 ZIF PGA SOCKET 225 PIN 18 X 18 Aries Electronics	3068	122.04	- + Добавить Немедленный		-	PLS	Active	PGA, ZIF (ZIP)	225 (15 x 15)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
225-PRS17007-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3156	122.04	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
225-PRS18003-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2575	122.04	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
289-PLS17001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3409	122.61	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
210-PRS19034-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3321	124.36	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
36-6552-18 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2376	124.89	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
36-6553-18 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	3917	124.89	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
36-6554-18 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2455	124.89	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
36-3551-18 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2528	124.89	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
36-3552-18 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	3272	124.89	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
36-3553-18 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2777	124.89	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
36-6551-18 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2071	124.89	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
36-3554-18 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	2021	124.89	- + Добавить Немедленный		Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyetheretherketone (PEEK), Glass Filled
264-4205-00 3M TEXTOOL OPEN-TOP SOCKETS FOR 3M	3893	125.63	- + Добавить Немедленный		Box	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
28-3575-18 CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics	3404	128.24	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
28-6575-18 CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics	3338	128.24	- + Добавить Немедленный	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
216-PLS21016-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2480	128.76	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
216-PRS21016-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2386	128.76	- + Добавить Немедленный	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
280-PLS19006-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2488	131.69	- + Добавить Немедленный	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)