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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
32-6552-18CONN IC DIP SOCKET ZIF 32POS |
3980 | 118.06 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
32-6553-18CONN IC DIP SOCKET ZIF 36POS TIN |
2369 | 118.06 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
32-3554-18CONN IC DIP SOCKET ZIF 32POS |
3903 | 118.06 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
40-6554-18CONN IC DIP SOCKET ZIF 40POS |
2409 | 140.30 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled |
|
|
40-3551-18CONN IC DIP SOCKET ZIF 40POS |
2338 | 140.30 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
40-3552-18CONN IC DIP SOCKET ZIF 40POS |
2460 | 140.30 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
40-3553-18CONN IC DIP SOCKET ZIF 40POS |
3287 | 140.30 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
42-6554-18CONN IC DIP SOCKET ZIF 42POS |
3053 | 147.15 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
36-3574-18CONN IC DIP SOCKET ZIF 36POS TIN |
3406 | 149.38 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-3575-18CONN IC DIP SOCKET ZIF 36POS TIN |
3870 | 149.38 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-6574-18CONN IC DIP SOCKET ZIF 36POS TIN |
3133 | 149.38 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-6575-18CONN IC DIP SOCKET ZIF 36POS TIN |
2056 | 149.38 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-3552-18CONN IC DIP SOCKET ZIF 44POS |
2882 | 154.00 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
44-3553-18CONN IC DIP SOCKET ZIF 44POS |
2239 | 154.00 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
44-6551-18CONN IC DIP SOCKET ZIF 44POS |
2552 | 154.00 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
44-6552-18CONN IC DIP SOCKET ZIF 44POS |
2042 | 154.00 |
ДобавитьНемедленный |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | |
|
|
441-PGG21001-40CONN SOCKET PGA GOLD |
2553 | 87.81 |
ДобавитьНемедленный |
Datenblatt |
Bulk | PGG | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
169-PLS13001-12CONN SOCKET PGA ZIF GOLD |
2637 | 88.49 |
ДобавитьНемедленный |
Datenblatt |
Bulk | PLS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
|
235-3019-02-0602CONN ZIG-ZAG ZIF 35POS GOLD |
3530 | 85.35 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 35 (1 x 17, 1 x 18) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
96-PRS14024-12CONN SOCKET PGA ZIF GOLD |
3736 | 88.99 |
ДобавитьНемедленный |
Datenblatt |
Bulk | PRS | Active | PGA, ZIF (ZIP) | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) |
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