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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
84-PRS12022-12

84-PRS12022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3325 76.92
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84-PRS12022-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS13053-12

84-PRS13053-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2445 76.92
- +

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84-PRS13053-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS13125-12

84-PRS13125-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2250 76.92
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84-PRS13125-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
550-10-652M35-001152

550-10-652M35-001152

BGA SOLDER TAIL

Preci-Dip

3912 74.27
- +

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550-10-652M35-001152

Datenblatt

Bulk 550 Active BGA 652 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-13-361-19-000001

510-13-361-19-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2812 77.24
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510-13-361-19-000001

Datenblatt

Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-361-19-000002

510-13-361-19-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2322 77.24
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510-13-361-19-000002

Datenblatt

Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-361-19-000003

510-13-361-19-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3177 77.24
- +

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510-13-361-19-000003

Datenblatt

Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-600M35-001104

558-10-600M35-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2918 74.53
- +

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558-10-600M35-001104

Datenblatt

Bulk 558 Active BGA 600 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-600M35-001105

518-77-600M35-001105

CONN SOCKET PGA 600POS GOLD

Preci-Dip

3057 74.83
- +

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518-77-600M35-001105

Datenblatt

Bulk 518 Active PGA 600 (35 x 35) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
18-PRS17041-12

18-PRS17041-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2532 78.44
- +

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18-PRS17041-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
56-PRS15057-12

56-PRS15057-12

ZIF PGA SOCKET 56PIN 15X15

Aries Electronics

3488 78.54
- +

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Немедленный

- PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
56-PLS14031-12

56-PLS14031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3845 78.54
- +

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Немедленный

56-PLS14031-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
56-PLS15057-12

56-PLS15057-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2763 78.54
- +

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Немедленный

56-PLS15057-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
56-PRS14031-12

56-PRS14031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2278 78.54
- +

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Немедленный

56-PRS14031-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
44-6552-16

44-6552-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

3103 78.91
- +

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Немедленный

44-6552-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3554-16

44-3554-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2682 78.91
- +

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Немедленный

44-3554-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6553-16

44-6553-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2098 78.91
- +

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Немедленный

44-6553-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3551-16

44-3551-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2446 78.91
- +

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Немедленный

44-3551-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3552-16

44-3552-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

3933 78.91
- +

Добавить

Немедленный

44-3552-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3553-16

44-3553-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2330 78.91
- +

Добавить

Немедленный

44-3553-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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