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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-3553-16

48-3553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2432 81.47
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48-3553-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6551-16

48-6551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2009 81.47
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48-6551-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6552-16

48-6552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2751 81.47
- +

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48-6552-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6553-16

48-6553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3728 81.47
- +

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48-6553-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3554-16

48-3554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2387 81.47
- +

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Немедленный

48-3554-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6554-16

48-6554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2752 81.47
- +

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Немедленный

48-6554-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
234-3034-01-0602

234-3034-01-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M

2598 81.56
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234-3034-01-0602

Datenblatt

Bulk Textool™ Active Zig-Zag, ZIF (ZIP) 34 (1 x 34) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
558-10-652M35-001101

558-10-652M35-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

2733 78.56
- +

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558-10-652M35-001101

Datenblatt

Bulk 558 Active PGA 652 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-361-18-101135

550-10-361-18-101135

PGA SOLDER TAIL

Preci-Dip

3871 79.37
- +

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550-10-361-18-101135

Datenblatt

Bulk 550 Active PGA 361 (18 x 18) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
80-PRS15072-12

80-PRS15072-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3156 82.76
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Немедленный

80-PRS15072-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
191-PGM18015-10T

191-PGM18015-10T

CONN SOCKET PGA TIN

Aries Electronics

2168 82.76
- +

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Немедленный

191-PGM18015-10T

Datenblatt

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
120-PLS13015-12

120-PLS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3370 83.29
- +

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Немедленный

120-PLS13015-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
120-PRS13015-12

120-PRS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2349 83.29
- +

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Немедленный

120-PRS13015-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
47-PLS16021-12

47-PLS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3632 83.41
- +

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Немедленный

47-PLS16021-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
47-PRS16021-12

47-PRS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3115 83.41
- +

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Немедленный

47-PRS16021-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PLS13013-12

121-PLS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2678 83.47
- +

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Немедленный

121-PLS13013-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PLS13106-12

121-PLS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2043 83.47
- +

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Немедленный

121-PLS13106-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PRS13013-12

121-PRS13013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2185 83.47
- +

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Немедленный

121-PRS13013-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PRS13106-12

121-PRS13106-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2793 83.47
- +

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Немедленный

121-PRS13106-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
510-13-400-20-000001

510-13-400-20-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3411 83.68
- +

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Немедленный

510-13-400-20-000001

Datenblatt

Bulk 510 Active PGA 400 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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