Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
EW-02-12-F-D-575 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	2007	0.82	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.030 (26.162mm)	0.125 (3.175mm)	0.575 (14.605mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-04-12-F-S-700 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	2257	0.82	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	4	0.100 (2.54mm)	1	-	1.030 (26.162mm)	-	0.700 (17.780mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-06-09-T-S-200 CONN HDR 6POS 0.1 STACK T/H TIN Samtec Inc.	3261	0.82	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	6	0.100 (2.54mm)	1	-	0.730 (18.542mm)	0.200 (5.080mm)	0.200 (5.080mm)	0.330 (8.382mm)	Through Hole	Solder	Tin	-
HW-02-10-F-D-425-275 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	3535	0.82	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.830 (21.082mm)	0.129 (3.277mm)	0.425 (10.800mm)	0.276 (7.000mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-02-08-F-D-250-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3894	0.82	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.465 (11.811mm)	0.215 (5.461mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-08-F-D-290-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2864	0.82	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.465 (11.811mm)	0.175 (4.445mm)	0.290 (7.366mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-12-T-Q-635-145 CONN HDR 4POS 0.1 STACK T/H Samtec Inc.	2636	0.82	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.200 (5.08mm)	1.030 (26.162mm)	0.250 (6.350mm)	0.635 (16.129mm)	0.145 (3.683mm)	Through Hole	Solder	Tin	-
HW-02-08-F-D-307-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2591	0.82	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.465 (11.811mm)	0.158 (4.013mm)	0.307 (7.798mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-08-F-D-355-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3045	0.82	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.465 (11.811mm)	0.110 (2.794mm)	0.355 (9.017mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
DW-03-09-T-S-236-002 .100 FLEX STACK, FLEXIBLE BOARD Samtec Inc.	3451	0.82	- + Добавить Немедленный		Bulk	Flex Stack, DW	Active	3	0.100 (2.54mm)	1	-	0.730 (18.542mm)	0.384 (9.754mm)	0.236 (5.994mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
ZW-02-12-F-D-394-557 .100 FLEX STACK, FLEXIBLE BOARD Samtec Inc.	2122	0.82	- + Добавить Немедленный		Bulk	Flex Stack, ZW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.030 (26.162mm)	0.079 (2.000mm)	0.394 (10.008mm)	0.557 (14.148mm)	Through Hole	Solder	Gold	Flash
59202-G26-05-045LF CONN HDR 10P 0.079 STACK SMD Amphenol ICC (FCI)	2257	0.82	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	10	0.079 (2.00mm)	2	0.079 (2.00mm)	0.335 (8.500mm)	0.157 (4.000mm)	0.177 (4.500mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
54122-108100950LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	2920	0.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.431 (10.950mm)	0.374 (9.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54112-109101800LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	3830	0.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.221 (5.613mm)	0.709 (18.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54112-809101700LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	2387	0.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.261 (6.629mm)	0.669 (17.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54111-103100950LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	2445	0.82	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.157 (4.000mm)	0.374 (9.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54112-109101450LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	3065	0.82	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.359 (9.119mm)	0.571 (14.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-108101800LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	3991	0.82	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.096 (2.450mm)	0.709 (18.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54112-109101400LF CONN HDR STACK Amphenol ICC (FCI)	2759	0.82	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
5-146469-3 CONN HDR 3POS 0.1 STACK T/H GOLD TE Connectivity AMP Connectors	3822	0.82	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	3	0.100 (2.54mm)	1	-	1.030 (26.162mm)	0.330 (8.382mm)	0.600 (15.240mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)