Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-03-08-T-D-315 CONN HDR 6POS 0.1 STACK T/H TIN Samtec Inc.	3058	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.530 (13.462mm)	0.105 (2.667mm)	0.315 (8.000mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
DW-03-08-TM-D-310 CONN HDR 6POS 0.1 STACK T/H TIN Samtec Inc.	3398	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.530 (13.462mm)	0.110 (2.794mm)	0.310 (7.874mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
DW-03-14-LM-S-1025 CONN HDR 3POS 0.1 STACK T/H GOLD Samtec Inc.	3815	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	3	0.100 (2.54mm)	1	-	1.430 (36.322mm)	0.295 (7.493mm)	1.025 (26.035mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
DW-04-08-LM-S-205 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	2884	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	1	-	0.530 (13.462mm)	0.215 (5.461mm)	0.205 (5.207mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
DW-05-10-T-S-570 CONN HDR 5POS 0.1 STACK T/H TIN Samtec Inc.	2972	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	5	0.100 (2.54mm)	1	-	0.830 (21.082mm)	0.150 (3.810mm)	0.570 (14.478mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
DW-06-08-T-S-325 CONN HDR 6POS 0.1 STACK T/H TIN Samtec Inc.	2208	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	6	0.100 (2.54mm)	1	-	0.530 (13.462mm)	0.095 (2.413mm)	0.325 (8.255mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
HW-02-15-FM-D-255-200 CONN HDR 4POS 0.1 STACK T/H Samtec Inc.	2123	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.630 (16.002mm)	0.175 (4.445mm)	0.255 (6.477mm)	0.200 (5.080mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-02-15-FM-D-255-250 CONN HDR 4POS 0.1 STACK T/H Samtec Inc.	3992	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.630 (16.002mm)	0.125 (3.175mm)	0.255 (6.477mm)	0.250 (6.350mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-03-10-T-S-250-SM CONN HDR 3POS 0.1 STACK SMD TIN Samtec Inc.	3592	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	3	0.100 (2.54mm)	1	-	0.765 (19.431mm)	0.515 (13.081mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Tin	-
HW-03-15-FM-S-255-250 CONN HDR 3POS 0.1 STACK T/H Samtec Inc.	3984	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	3	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.125 (3.175mm)	0.255 (6.477mm)	0.250 (6.350mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
TW-04-01-T-S-200-065 2.00 MM FLEX STACK, FLEXIBLE BOA Samtec Inc.	3142	0.81	- + Добавить Немедленный		Bulk	TW	Active	4	0.079 (2.00mm)	1	-	0.323 (8.204mm)	0.058 (1.473mm)	0.200 (5.080mm)	0.065 (1.651mm)	Through Hole	Solder	Tin	-
54111-803080850LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3759	0.81	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.197 (5.000mm)	0.335 (8.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
5-146461-4 CONN HDR 4POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3369	0.81	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	4	0.100 (2.54mm)	1	-	0.739 (18.771mm)	0.129 (3.277mm)	0.500 (12.700mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
146458-4 CONN HDR 4POS 0.1 STACK T/H TE Connectivity AMP Connectors	3569	0.81	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	4	0.100 (2.54mm)	1	-	0.533 (13.538mm)	0.123 (3.124mm)	0.300 (7.620mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
75970-175-07LF CONN HDR 7POS 0.1 STACK T/H Amphenol ICC (FCI)	3738	0.81	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	7	0.100 (2.54mm)	1	-	0.695 (17.650mm)	0.122 (3.100mm)	0.450 (11.430mm)	0.122 (3.100mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-109101700LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	3982	0.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.236 (6.000mm)	0.669 (17.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-109101500LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	2695	0.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.315 (8.000mm)	0.591 (15.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-109101600LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	3529	0.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.275 (6.985mm)	0.630 (16.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-412141850LF CONN HDR 14POS 0.100 STACK TH Amphenol ICC (FCI)	3560	0.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.477 (12.116mm)	0.728 (18.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-809101600LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	3214	0.82	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.275 (6.985mm)	0.630 (16.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)