Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
EW-02-11-F-D-366 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	3954	0.79	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.930 (23.622mm)	0.234 (5.944mm)	0.366 (9.296mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-02-11-F-D-433 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	3563	0.79	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.930 (23.622mm)	0.167 (4.242mm)	0.433 (11.000mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-02-11-F-D-470 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	3952	0.79	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.930 (23.622mm)	0.130 (3.302mm)	0.470 (11.938mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-02-11-T-D-250-SM CONN HDR 4POS 0.1 STACK SMD TIN Samtec Inc.	3071	0.79	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.865 (21.971mm)	0.615 (15.621mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Tin	-
HW-03-08-F-S-255-SM CONN HDR 3POS 0.1 STACK SMD GOLD Samtec Inc.	3498	0.79	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	3	0.100 (2.54mm)	1	-	0.465 (11.811mm)	0.210 (5.334mm)	0.255 (6.477mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
TW-03-02-F-S-140-100 2.00 MM FLEX STACK, FLEXIBLE BOA Samtec Inc.	2277	0.79	- + Добавить Немедленный		Bulk	TW	Active	3	0.079 (2.00mm)	1	-	0.377 (9.576mm)	0.137 (3.480mm)	0.140 (3.556mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
ZW-03-15-T-S-236-130-002 .100 FLEX STACK, FLEXIBLE BOARD Samtec Inc.	2893	0.79	- + Добавить Немедленный		Bulk	Flex Stack, ZW	Active	3	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.264 (6.706mm)	0.236 (5.994mm)	0.130 (3.302mm)	Through Hole	Solder	Tin	-
5-146506-2 CONN HDR 4POS 0.1 STACK T/H GOLD TE Connectivity AMP Connectors	3635	0.79	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.330 (33.782mm)	0.330 (8.382mm)	0.900 (22.860mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
54112-108101500LF CONN HDR 10POS 0.100 STACK T/H Amphenol ICC (FCI)	3494	0.80	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.239 (6.071mm)	0.591 (15.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-118081200LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2566	0.80	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	1	-	1.102 (28.000mm)	0.510 (12.950mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-103120800LF CONN HDR 12POS 0.100 STACK T/H Amphenol ICC (FCI)	2346	0.80	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	12	0.100 (2.54mm)	2	0.100 (2.54mm)	0.626 (15.900mm)	0.191 (4.851mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-407161075LF CONN HDR 16POS 0.100 STACK TH Amphenol ICC (FCI)	2033	0.80	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.282 (7.163mm)	0.423 (10.750mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-531102100LF CONN HDR STACK Amphenol ICC (FCI)	3128	0.80	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54112-803120900LF CONN HDR 12POS 0.100 STACK T/H Amphenol ICC (FCI)	3538	0.80	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	12	0.100 (2.54mm)	2	0.100 (2.54mm)	0.626 (15.900mm)	0.177 (4.500mm)	0.354 (9.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
77709-128LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2309	0.80	- + Добавить Немедленный		Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.695 (17.650mm)	0.122 (3.100mm)	0.451 (11.450mm)	0.122 (3.100mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-407121050LF CONN HDR 12POS 0.100 STACK TH Amphenol ICC (FCI)	2931	0.81	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	12	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.292 (7.417mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-403121000LF CONN HDR 12POS 0.100 STACK TH Amphenol ICC (FCI)	3727	0.81	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	12	0.100 (2.54mm)	2	0.100 (2.54mm)	0.626 (15.900mm)	0.112 (2.845mm)	0.394 (10.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
59202-S30-03A050LF CONN HDR STACK SMD Amphenol ICC (FCI)	3843	0.81	- + Добавить Немедленный		Tape & Reel (TR)	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54122-416102650LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	2032	0.81	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.425 (36.200mm)	0.262 (6.655mm)	1.043 (26.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
DW-02-07-L-D-200 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	2631	0.81	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.430 (10.922mm)	0.120 (3.048mm)	0.200 (5.080mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)