Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54112-110082250LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3371	0.64	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.145 (3.683mm)	0.886 (22.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
10132990-001TRLF CONN HDR STACK Amphenol ICC (FCI)	2808	0.64	- + Добавить Немедленный		Tape & Reel (TR)	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
76745-321-10LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	3926	0.65	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.471 (11.963mm)	0.728 (18.500mm)	0.126 (3.200mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-412101050LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	3205	0.65	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.792 (20.117mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
146505-2 CONN HDR 4POS 0.1 STACK T/H TE Connectivity AMP Connectors	2249	0.65	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.330 (33.782mm)	0.120 (3.050mm)	1.100 (27.940mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
5-146483-4 CONN HDR 8POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3630	0.65	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
146483-4 CONN HDR 8POS 0.1 STACK T/H TE Connectivity AMP Connectors	3401	0.65	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
5-146474-3 CONN HDR 3POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2117	0.66	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	3	0.100 (2.54mm)	1	-	1.230 (31.242mm)	0.120 (3.050mm)	1.000 (25.400mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
75970-112-06LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	2381	0.66	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	0.525 (13.335mm)	0.224 (5.700mm)	0.200 (5.080mm)	0.100 (2.540mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-110080850LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3555	0.66	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.670 (17.018mm)	0.335 (8.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-810081600LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2631	0.66	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.375 (9.525mm)	0.630 (16.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
59202-M26-06A054LF CONN HDR STACK SMD Amphenol ICC (FCI)	2490	0.66	- + Добавить Немедленный		Tape & Reel (TR)	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
90599-050 CONN HDR 8POS 0.079 STACK T/H Amphenol ICC (FCI)	2556	0.66	- + Добавить Немедленный		Bag	Minitek® 2.00mm	Active	8	0.079 (2.00mm)	2	0.079 (2.00mm)	0.500 (12.700mm)	0.171 (4.350mm)	0.157 (4.000mm)	0.171 (4.350mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
146480-3 CONN HDR 3POS 0.1 STACK T/H TE Connectivity AMP Connectors	3311	0.66	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	3	0.100 (2.54mm)	1	-	1.430 (36.322mm)	0.120 (3.050mm)	1.200 (30.480mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
54121-402100800LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	2888	0.66	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	1	-	0.531 (13.500mm)	0.096 (2.450mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-156-04LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2505	0.72	- + Добавить Немедленный	Datenblatt	Box,Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.260 (32.000mm)	0.394 (10.000mm)	0.748 (19.000mm)	0.118 (3.000mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59112-T38-02-135LF CONN HDR 4POS 0.079 STACK T/H Amphenol ICC (FCI)	3860	0.66	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.752 (19.100mm)	0.122 (3.100mm)	0.531 (13.500mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
59202-F24-06A055LF CONN HDR 12P 0.079 STACK SMD Amphenol ICC (FCI)	3786	0.67	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Minitek® 2.00mm	Active	12	0.079 (2.00mm)	2	0.079 (2.00mm)	0.311 (7.900mm)	0.094 (2.400mm)	0.217 (5.500mm)	-	Surface Mount	Solder	Gold	8.00µin (0.203µm)
5-146461-5 CONN HDR 5POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3352	0.67	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	5	0.100 (2.54mm)	1	-	0.739 (18.771mm)	0.129 (3.277mm)	0.500 (12.700mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
DW-02-07-F-D-200 CONN HDR 4POS 0.1 STACK T/H GOLD Samtec Inc.	3402	0.67	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.430 (10.922mm)	0.120 (3.048mm)	0.200 (5.080mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)