Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54112-811042400LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2748	0.62	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.185 (4.700mm)	0.945 (24.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-806080950LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3158	0.62	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.250 (6.350mm)	0.374 (9.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-806081150LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3544	0.62	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.171 (4.350mm)	0.453 (11.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-106081000LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2248	0.63	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.230 (5.842mm)	0.394 (10.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59132-T36-05-098LF CONN HDR 10POS 0.079 STACK TH Amphenol ICC (FCI)	2605	0.63	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	10	0.079 (2.00mm)	2	0.079 (2.00mm)	0.673 (17.100mm)	0.169 (4.300mm)	0.386 (9.800mm)	0.118 (3.000mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
54121-404050700LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	2284	0.63	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.660 (16.764mm)	0.264 (6.700mm)	0.276 (7.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-412101850LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	3605	0.63	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.477 (12.116mm)	0.728 (18.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
59112-S32-02-080LF CONN HDR STACK Amphenol ICC (FCI)	3173	0.63	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
59202-H28-04-066LF CONN HDR 8POS 0.079 STACK SMD Amphenol ICC (FCI)	3048	0.64	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	8	0.079 (2.00mm)	2	0.079 (2.00mm)	0.398 (10.100mm)	0.138 (3.500mm)	0.260 (6.600mm)	-	Surface Mount	Solder	Gold	Flash
5-146458-5 CONN HDR 5POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3722	0.64	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	5	0.100 (2.54mm)	1	-	0.533 (13.538mm)	0.123 (3.124mm)	0.300 (7.620mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
54112-807081400LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3468	0.64	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.179 (4.550mm)	0.551 (14.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-107080950LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2171	0.64	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.356 (9.050mm)	0.374 (9.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-107081200LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2453	0.64	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.232 (5.900mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-807081300LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3750	0.64	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.193 (4.902mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
5-146475-1 CONN HDR 1POS STACK T/H GOLD TE Connectivity AMP Connectors	3394	0.64	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	1.230 (31.242mm)	0.330 (8.382mm)	0.800 (20.320mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
5-146478-1 CONN HDR 1POS STACK T/H GOLD TE Connectivity AMP Connectors	3717	0.64	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	1.330 (33.782mm)	0.330 (8.382mm)	0.900 (22.860mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
5-146481-1 CONN HDR 1POS STACK T/H GOLD TE Connectivity AMP Connectors	2404	0.64	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	1.430 (36.322mm)	0.330 (8.382mm)	1.000 (25.400mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
146475-1 CONN HDR 1POS STACK T/H GOLD TE Connectivity AMP Connectors	2868	0.64	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	1.230 (31.242mm)	0.330 (8.382mm)	0.800 (20.320mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
DW-02-10-T-D-610 CONN HDR 4POS 0.1 STACK T/H TIN Samtec Inc.	3130	0.64	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.830 (21.082mm)	0.110 (2.794mm)	0.610 (15.494mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
DW-03-10-F-S-315 CONN HDR 3POS 0.1 STACK T/H GOLD Samtec Inc.	3045	0.64	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	3	0.100 (2.54mm)	1	-	0.830 (21.082mm)	0.405 (10.287mm)	0.315 (8.000mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)