Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
HW-02-08-F-S-250-SM CONN HDR 2POS 0.1 STACK SMD GOLD Samtec Inc.	2335	0.60	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	2	0.100 (2.54mm)	1	-	0.465 (11.811mm)	0.215 (5.461mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-11-F-S-590-128 CONN HDR 2POS 0.1 STACK T/H Samtec Inc.	2868	0.60	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	2	0.100 (2.54mm)	1	-	0.930 (23.622mm)	0.212 (5.385mm)	0.590 (14.986mm)	0.128 (3.251mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-02-17-F-S-250-SM CONN HDR 2POS 0.1 STACK SMD GOLD Samtec Inc.	3335	0.60	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	2	0.100 (2.54mm)	1	-	0.415 (10.541mm)	0.165 (4.191mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-17-F-S-251-SM CONN HDR 2POS 0.1 STACK SMD GOLD Samtec Inc.	2069	0.60	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	2	0.100 (2.54mm)	1	-	0.415 (10.541mm)	0.164 (4.166mm)	0.251 (6.375mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-20-T-S-250-SM CONN HDR 2POS 0.1 STACK SMD TIN Samtec Inc.	2340	0.60	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	2	0.100 (2.54mm)	1	-	1.065 (27.051mm)	0.815 (20.700mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Tin	-
5-146480-3 CONN HDR 3POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3493	0.60	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	3	0.100 (2.54mm)	1	-	1.430 (36.322mm)	0.120 (3.050mm)	1.200 (30.480mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
5-146464-1 CONN HDR 1POS STACK T/H GOLD TE Connectivity AMP Connectors	2447	0.60	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	0.817 (20.752mm)	0.087 (2.210mm)	0.400 (10.160mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
5-146466-1 CONN HDR 1POS STACK T/H GOLD TE Connectivity AMP Connectors	3755	0.60	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	0.930 (23.622mm)	0.100 (2.540mm)	0.500 (12.700mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
146468-3 CONN HDR 3POS 0.1 STACK T/H TE Connectivity AMP Connectors	3434	0.60	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	3	0.100 (2.54mm)	1	-	1.030 (26.162mm)	0.120 (3.050mm)	0.800 (20.320mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
59202-F24-02A053LF CONN HDR 4POS 0.079 STACK SMD Amphenol ICC (FCI)	3904	0.61	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Minitek® 2.00mm	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.311 (7.900mm)	0.102 (2.600mm)	0.209 (5.300mm)	-	Surface Mount	Solder	Gold	8.00µin (0.203µm)
54112-106081350LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3220	0.61	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.118 (3.000mm)	0.531 (13.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
5-146483-3 CONN HDR 6POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2388	0.61	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
59202-T32-03A085LF CONN HDR 6POS 0.079 STACK SMD Amphenol ICC (FCI)	2279	0.61	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Minitek® 2.00mm	Active	6	0.079 (2.00mm)	2	0.079 (2.00mm)	0.488 (12.400mm)	0.154 (3.900mm)	0.335 (8.500mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
54122-109080900LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2232	0.61	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.551 (14.000mm)	0.354 (9.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
75970-590R04LF CONN HDR 4POS 0.100 STACK T/H Amphenol ICC (FCI)	2323	0.62	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.515 (13.081mm)	0.307 (7.800mm)	0.256 (6.500mm)	0.130 (3.300mm)	Through Hole	Solder	Gold	Flash
54111-101050850LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	2920	0.62	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.480 (12.200mm)	0.051 (1.295mm)	0.335 (8.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
5-146469-1 CONN HDR 1POS STACK T/H GOLD TE Connectivity AMP Connectors	3631	0.62	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	1.030 (26.162mm)	0.330 (8.382mm)	0.600 (15.240mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
5-146468-3 CONN HDR 3POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3393	0.62	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	3	0.100 (2.54mm)	1	-	1.030 (26.162mm)	0.120 (3.050mm)	0.800 (20.320mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
5-146503-1 CONN HDR 2POS STACK T/H GOLD TE Connectivity AMP Connectors	2075	0.62	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	2	-	2	0.100 (2.54mm)	1.230 (31.242mm)	0.330 (8.382mm)	0.800 (20.320mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
146503-1 CONN HDR 2POS STACK T/H GOLD TE Connectivity AMP Connectors	2195	0.62	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	2	-	2	0.100 (2.54mm)	1.230 (31.242mm)	0.330 (8.382mm)	0.800 (20.320mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)