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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
42-3570-16

42-3570-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3496 55.98
- +

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Немедленный

42-3570-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-3571-16

42-3571-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3678 55.98
- +

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Немедленный

42-3571-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-3572-16

42-3572-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3904 55.98
- +

Добавить

Немедленный

42-3572-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-3573-16

42-3573-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

2484 55.98
- +

Добавить

Немедленный

42-3573-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-3574-16

42-3574-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2710 55.98
- +

Добавить

Немедленный

42-3574-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3575-16

42-3575-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2098 55.98
- +

Добавить

Немедленный

42-3575-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6570-16

42-6570-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

2359 55.98
- +

Добавить

Немедленный

42-6570-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-6571-16

42-6571-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3499 55.98
- +

Добавить

Немедленный

42-6571-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-6572-16

42-6572-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2421 55.98
- +

Добавить

Немедленный

42-6572-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6573-16

42-6573-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3605 55.98
- +

Добавить

Немедленный

42-6573-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6575-16

42-6575-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2765 55.98
- +

Добавить

Немедленный

42-6575-16

Datenblatt

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
518-77-432M31-001105

518-77-432M31-001105

CONN SOCKET PGA 432POS GOLD

Preci-Dip

3008 53.88
- +

Добавить

Немедленный

518-77-432M31-001105

Datenblatt

Bulk 518 Active PGA 432 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
546-83-528-21-121147

546-83-528-21-121147

CONN SOCKET PGA 528POS GOLD

Preci-Dip

2747 54.45
- +

Добавить

Немедленный

546-83-528-21-121147

Datenblatt

Bulk 546 Active PGA 528 (21 x 21) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-529-21-121147

546-83-529-21-121147

CONN SOCKET PGA 529POS GOLD

Preci-Dip

2709 54.55
- +

Добавить

Немедленный

546-83-529-21-121147

Datenblatt

Bulk 546 Active PGA 529 (21 x 21) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-545-17-000147

546-83-545-17-000147

CONN SOCKET PGA 545POS GOLD

Preci-Dip

3303 54.56
- +

Добавить

Немедленный

546-83-545-17-000147

Datenblatt

Bulk 546 Active PGA 545 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-238-19-086001

510-13-238-19-086001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2389 56.91
- +

Добавить

Немедленный

510-13-238-19-086001

Datenblatt

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-238-19-086002

510-13-238-19-086002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2036 56.91
- +

Добавить

Немедленный

510-13-238-19-086002

Datenblatt

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-238-19-086003

510-13-238-19-086003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3013 56.91
- +

Добавить

Немедленный

510-13-238-19-086003

Datenblatt

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-441-21-000001

510-93-441-21-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2958 57.08
- +

Добавить

Немедленный

510-93-441-21-000001

Datenblatt

Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-441-21-000002

510-93-441-21-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3749 57.08
- +

Добавить

Немедленный

510-93-441-21-000002

Datenblatt

Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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