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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-400-20-000003

510-93-400-20-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2017 53.41
- +

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510-93-400-20-000003

Datenblatt

Bulk 510 Active PGA 400 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
132-PGM13038-50

132-PGM13038-50

CONN SOCKET PGA GOLD

Aries Electronics

2392 53.57
- +

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- PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-11-256-16-000001

510-11-256-16-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3912 53.76
- +

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510-11-256-16-000001

Datenblatt

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-11-256-16-000002

510-11-256-16-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2381 53.76
- +

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510-11-256-16-000002

Datenblatt

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-652M35-001166

550-10-652M35-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

2170 51.74
- +

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550-10-652M35-001166

Datenblatt

Bulk 550 Active BGA 652 (35 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-503-22-131147

546-83-503-22-131147

CONN SOCKET PGA 503POS GOLD

Preci-Dip

3708 51.87
- +

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546-83-503-22-131147

Datenblatt

Bulk 546 Active PGA 503 (22 x 22) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-296-19-131147

546-83-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip

2029 52.13
- +

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546-83-296-19-131147

Datenblatt

Bulk 546 Active PGA 296 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-420M26-001104

558-10-420M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3020 52.17
- +

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558-10-420M26-001104

Datenblatt

Bulk 558 Active BGA 420 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-13-223-18-095001

510-13-223-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3012 54.43
- +

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Немедленный

510-13-223-18-095001

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-095003

510-13-223-18-095003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2003 54.43
- +

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Немедленный

510-13-223-18-095003

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-098001

510-13-223-18-098001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2978 54.43
- +

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Немедленный

510-13-223-18-098001

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-098002

510-13-223-18-098002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2881 54.43
- +

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Немедленный

510-13-223-18-098002

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-098003

510-13-223-18-098003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3470 54.43
- +

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Немедленный

510-13-223-18-098003

Datenblatt

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-223-18-095002

510-13-223-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2707 54.43
- +

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Немедленный

510-13-223-18-095002

Datenblatt

Tube 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
518-77-420M26-001105

518-77-420M26-001105

CONN SOCKET PGA 420POS GOLD

Preci-Dip

3126 52.38
- +

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Немедленный

518-77-420M26-001105

Datenblatt

Bulk 518 Active PGA 420 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-13-224-18-095001

510-13-224-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3507 54.60
- +

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Немедленный

510-13-224-18-095001

Datenblatt

Bulk 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-224-18-095003

510-13-224-18-095003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2158 54.60
- +

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Немедленный

510-13-224-18-095003

Datenblatt

Bulk 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-224-18-095002

510-13-224-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2268 54.60
- +

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Немедленный

510-13-224-18-095002

Datenblatt

Tube 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
50-9508-21

50-9508-21

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

2866 54.62
- +

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Немедленный

50-9508-21

Datenblatt

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
50-9508-31

50-9508-31

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

3527 54.62
- +

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Немедленный

50-9508-31

Datenblatt

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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