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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-13-128-13-041002SKT PGA SOLDRTL |
2155 | 38.73 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-128-13-041001SKT PGA SOLDRTL |
3301 | 38.73 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-128-13-041003SKT PGA SOLDRTL |
2040 | 38.73 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
APA-648-G-BADAPTER PLUG |
2300 | 38.77 |
ДобавитьНемедленный |
Bulk | APA | Active | - | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
614-83-279-19-081112CONN SOCKET PGA 279POS GOLD |
3377 | 36.17 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 614 | Active | PGA | 279 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-93-238-19-086002PGS SOCK 238 PIN 19X19 SOLDER TL |
3987 | 38.90 |
ДобавитьНемедленный |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-93-238-19-086001SKT PGA SOLDRTL |
3802 | 38.90 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-238-19-086003SKT PGA SOLDRTL |
3051 | 38.90 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
48-3570-11CONN IC DIP SOCKET ZIF 48POS GLD |
3848 | 38.96 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
24-6556-41CONN IC DIP SOCKET 24POS GOLD |
2085 | 40.70 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
514-83-357M19-001148CONN SOCKET BGA 357POS GOLD |
2883 | 38.26 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 514 | Active | BGA | 357 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
100-PGM10001-51CONN SOCKET PGA GOLD |
2159 | 40.81 |
ДобавитьНемедленный |
Datenblatt |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-3574-16CONN IC DIP SOCKET ZIF 32POS |
2146 | 40.82 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
614-87-320-19-131144CONN SOCKET PGA 320POS GOLD |
2252 | 39.30 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 614 | Active | PGA | 320 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-321-19-121144CONN SOCKET PGA 321POS GOLD |
2824 | 39.42 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 614 | Active | PGA | 321 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-356M26-001152BGA SOLDER TAIL |
3362 | 39.37 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 550 | Active | BGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
510-13-142-15-085001SKT PGA SOLDRTL |
2337 | 41.04 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 142 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-142-15-085002SKT PGA SOLDRTL |
3600 | 41.04 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 142 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
48-3572-11CONN IC DIP SOCKET ZIF 48POS GLD |
2991 | 38.96 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-3573-11CONN IC DIP SOCKET ZIF 48POS GLD |
2152 | 38.96 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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