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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
28-3570-16CONN IC DIP SOCKET ZIF 28POS |
2745 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6570-16CONN IC DIP SOCKET ZIF 28POS |
3494 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6571-16CONN IC DIP SOCKET ZIF 28POS |
3238 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6573-16CONN IC DIP SOCKET ZIF 28POS TIN |
3707 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-3571-16CONN IC DIP SOCKET ZIF 28POS |
2819 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-3572-16CONN IC DIP SOCKET ZIF 28POS |
2974 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-3573-16CONN IC DIP SOCKET ZIF 28POS |
2415 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-3574-16CONN IC DIP SOCKET ZIF 28POS GLD |
3153 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6572-16CONN IC DIP SOCKET ZIF 28POS TIN |
2518 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6574-16CONN IC DIP SOCKET ZIF 28POS TIN |
3134 | 38.52 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
510-41-281-19-081002SKT PGA SOLDRTL |
2115 | 38.53 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-281-19-081002SOCKET SOLDERTAIL 281-PGA |
3173 | 38.53 |
ДобавитьНемедленный |
Bulk | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-281-19-081001SKT PGA SOLDRTL |
3519 | 38.53 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-281-19-081003SKT PGA SOLDRTL |
2077 | 38.53 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
550-10-480M29-001166BGA PIN ADAPTER 1.27MM SMD |
3829 | 36.98 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 550 | Active | BGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
517-83-599-54-131111CONN SOCKET PGA 599POS GOLD |
2914 | 35.83 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 517 | Active | PGA | 599 (54 x 54) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
210-2599-50-06023M TEXTOOL ZIP STRIP SOCKETS 210 |
3082 | 38.58 |
ДобавитьНемедленный |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
48-6503-21CONN IC DIP SOCKET 48POS GOLD |
2669 | 38.62 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
48-6503-31CONN IC DIP SOCKET 48POS GOLD |
2100 | 38.62 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 503 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
518-77-292M20-001106CONN SOCKET PGA 292POS GOLD |
2491 | 36.26 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 518 | Active | PGA | 292 (20 x 20) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
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