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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
42-3572-10CONN IC DIP SOCKET ZIF 42POS TIN |
3346 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-3573-10CONN IC DIP SOCKET ZIF 42POS TIN |
2565 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-3574-10CONN IC DIP SOCKET ZIF 42POS TIN |
2784 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-3575-10CONN IC DIP SOCKET ZIF 42POS TIN |
2229 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-6570-10CONN IC DIP SOCKET ZIF 42POS TIN |
2791 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
30-0508-21CONN SOCKET SIP 30POS GOLD |
3266 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
30-0508-31CONN SOCKET SIP 30POS GOLD |
3961 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
123-93-952-41-001000CONN IC DIP SOCKET 52POS GOLD |
2003 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
123-43-952-41-001000CONN IC SKT DBL |
2135 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-168-17-101002SOCKET SOLDERTAIL 168-PGA |
2665 | 22.05 |
ДобавитьНемедленный |
Tube | 510 | Active | PGA | 168 (17 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-41-168-17-101002SKT PGA SOLDRTL |
2920 | 22.05 |
ДобавитьНемедленный |
Datenblatt |
Tube | 510 | Active | PGA | 168 (17 x 17) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-43-428-61-003000CONN IC SKT DBL |
2604 | 22.06 |
ДобавитьНемедленный |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-93-428-61-003000CONN IC SKT DBL |
2260 | 22.06 |
ДобавитьНемедленный |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-43-422-61-605000CONN IC SKT DBL |
3488 | 22.06 |
ДобавитьНемедленный |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-422-61-605000CONN IC SKT DBL |
2659 | 22.06 |
ДобавитьНемедленный |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
30-1508-21CONN IC DIP SOCKET 30POS GOLD |
2833 | 22.07 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
30-1508-31CONN IC DIP SOCKET 30POS GOLD |
2188 | 22.07 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
48-6823-90TCONN IC DIP SOCKET 48POS TIN |
2440 | 22.07 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
1554653-1CONN SOCKET LGA 2011POS GOLD |
3637 | 22.07 |
ДобавитьНемедленный |
Datenblatt |
Tray | - | Last Time Buy | LGA | 2011 (47 x 58) | - | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
126-93-648-41-003000CONN IC DIP SOCKET 48POS GOLD |
2863 | 22.09 |
ДобавитьНемедленный |
Datenblatt |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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