Sockets for ICs, Transistors - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
34-6621-30 CONN IC DIP SOCKET 34POS TIN Aries Electronics	3505	21.77	- + Добавить Немедленный	Datenblatt	Bulk	6621	Active	DIP, 0.6 (15.24mm) Row Spacing	34 (2 x 17)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Bottom Entry; Through Board	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
69-PGM11030-11 CONN SOCKET PGA GOLD Aries Electronics	3746	21.77	- + Добавить Немедленный	Datenblatt	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
69-PGM11031-11 CONN SOCKET PGA GOLD Aries Electronics	2215	21.77	- + Добавить Немедленный	Datenblatt	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
69-PGM11053-11 CONN SOCKET PGA GOLD Aries Electronics	3838	21.77	- + Добавить Немедленный	Datenblatt	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-316-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2545	21.77	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-316-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3211	21.77	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
127-93-664-41-002000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	2421	21.80	- + Добавить Немедленный	Datenblatt	Tube	127	Active	DIP, 0.6 (15.24mm) Row Spacing	64 (2 x 32)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070 (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-664-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2473	21.80	- + Добавить Немедленный	Datenblatt	Tube	127	Active	DIP, 0.6 (15.24mm) Row Spacing	64 (2 x 32)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.070 (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-13-632-41-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3101	21.80	- + Добавить Немедленный	Datenblatt	Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-328-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2084	21.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
111-43-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3120	21.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
111-43-628-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3347	21.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
111-93-328-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3375	21.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
111-93-428-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2835	21.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
111-93-628-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2048	21.81	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
126-93-952-41-002000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	3734	21.82	- + Добавить Немедленный	Datenblatt	Tube	126	Active	DIP, 0.9 (22.86mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-952-41-002000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2526	21.82	- + Добавить Немедленный	Datenblatt	Tube	126	Active	DIP, 0.9 (22.86mm) Row Spacing	52 (2 x 26)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-632-41-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3430	21.83	- + Добавить Немедленный	Datenblatt	Tube	122	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-272M20-001166 BGA PIN ADAPTER 1.27MM SMD Preci-Dip	3570	20.95	- + Добавить Немедленный	Datenblatt	Bulk	550	Active	BGA	272 (20 x 20)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
110-41-652-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3560	21.84	- + Добавить Немедленный		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-