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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
27-7650-10

27-7650-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

3238 17.80
- +

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27-7650-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
123-91-652-41-001000

123-91-652-41-001000

SOCKET IC OPEN 3 LVL .600 52POS

Mill-Max Manufacturing Corp.

3290 17.80
- +

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Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-652-41-001000

123-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2735 17.80
- +

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123-41-652-41-001000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-83-299-16-091111

517-83-299-16-091111

CONN SOCKET PGA 299POS GOLD

Preci-Dip

3805 16.90
- +

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517-83-299-16-091111

Datenblatt

Bulk 517 Active PGA 299 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
126-41-640-41-002000

126-41-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2819 17.80
- +

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126-41-640-41-002000

Datenblatt

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-640-41-002000

126-91-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2680 17.80
- +

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126-91-640-41-002000

Datenblatt

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-952-31-007000

614-41-952-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2942 17.82
- +

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614-41-952-31-007000

Datenblatt

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-952-31-007000

614-91-952-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2671 17.82
- +

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Немедленный

614-91-952-31-007000

Datenblatt

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-636-41-001000

122-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2530 17.82
- +

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122-11-636-41-001000

Datenblatt

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-0511-11

16-0511-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2636 17.82
- +

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16-0511-11

Datenblatt

Bulk 511 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-650-41-007000

116-93-650-41-007000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3591 17.83
- +

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Немедленный

116-93-650-41-007000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-650-41-007000

116-43-650-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2045 17.83
- +

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Немедленный

116-43-650-41-007000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-648-41-770000

104-13-648-41-770000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3454 17.83
- +

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Немедленный

104-13-648-41-770000

Datenblatt

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
110-93-064-01-505000

110-93-064-01-505000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3134 17.84
- +

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Немедленный

110-93-064-01-505000

Datenblatt

Tube 110 Active - 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - - - - 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - -
123-13-318-41-801000

123-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3309 17.84
- +

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Немедленный

123-13-318-41-801000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
XR3G-6401

XR3G-6401

CONN IC SOCKET 64POS

Omron Electronics Inc-EMC Div

3141 9.33
- +

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Немедленный

XR3G-6401

Datenblatt

-,Box - Active - - - - - - - - - - - - - -
614-41-952-41-001000

614-41-952-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3778 17.86
- +

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Немедленный

614-41-952-41-001000

Datenblatt

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-952-41-001000

614-91-952-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3468 17.86
- +

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Немедленный

614-91-952-41-001000

Datenblatt

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-11-432-41-001000

123-11-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2007 17.87
- +

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Немедленный

123-11-432-41-001000

Datenblatt

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-11-632-41-001000

123-11-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3629 17.87
- +

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Немедленный

123-11-632-41-001000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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