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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-41-952-31-012000

614-41-952-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2387 17.54
- +

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Немедленный

614-41-952-31-012000

Datenblatt

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-952-31-012000

614-91-952-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3555 17.54
- +

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Немедленный

614-91-952-31-012000

Datenblatt

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-652-41-003000

116-93-652-41-003000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

2615 17.55
- +

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Немедленный

116-93-652-41-003000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-648-31-018000

614-43-648-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2408 17.55
- +

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Немедленный

614-43-648-31-018000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-952-41-006000

116-93-952-41-006000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

2198 17.55
- +

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Немедленный

116-93-952-41-006000

Datenblatt

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-952-41-006000

116-43-952-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3762 17.55
- +

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Немедленный

116-43-952-41-006000

Datenblatt

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
712-13-132-41-001000

712-13-132-41-001000

SOCKET CARRIER SIP 32POS

Mill-Max Manufacturing Corp.

2219 17.56
- +

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Немедленный

712-13-132-41-001000

Datenblatt

Tube 712 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-636-41-003000

612-43-636-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3810 17.58
- +

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Немедленный

612-43-636-41-003000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-636-41-003000

612-93-636-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2393 17.58
- +

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Немедленный

612-93-636-41-003000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
21-0508-21

21-0508-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2533 17.58
- +

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Немедленный

21-0508-21

Datenblatt

Bulk 508 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
21-0508-31

21-0508-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3487 17.58
- +

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Немедленный

21-0508-31

Datenblatt

Bulk 508 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
16-C195-21

16-C195-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3836 17.58
- +

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Немедленный

16-C195-21

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C195-31

16-C195-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2721 17.58
- +

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Немедленный

16-C195-31

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-21

16-C280-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2094 17.58
- +

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Немедленный

16-C280-21

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-31

16-C280-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2309 17.58
- +

Добавить

Немедленный

16-C280-31

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-87-321-19-121154

514-87-321-19-121154

CONN SOCKET PGA 321POS GOLD

Preci-Dip

3261 16.72
- +

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Немедленный

514-87-321-19-121154

Datenblatt

Bulk 514 Active PGA 321 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
321-13-132-41-001000

321-13-132-41-001000

SOCKET 1 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.

3379 17.60
- +

Добавить

Немедленный

321-13-132-41-001000

Datenblatt

Tube 321 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-108-12-051001

510-91-108-12-051001

SOCKET SOLDERTAIL 108-PGA

Mill-Max Manufacturing Corp.

3113 17.60
- +

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Немедленный

Tube 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-432-41-002000

126-93-432-41-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3427 17.60
- +

Добавить

Немедленный

126-93-432-41-002000

Datenblatt

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-632-41-002000

126-93-632-41-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3798 17.60
- +

Добавить

Немедленный

126-93-632-41-002000

Datenblatt

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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