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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
714-43-260-31-018000

714-43-260-31-018000

CONN IC DIP SOCKET 60POS GOLD

Mill-Max Manufacturing Corp.

2370 16.31
- +

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Немедленный

714-43-260-31-018000

Datenblatt

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-428-31-012000

614-93-428-31-012000

SOCKET CARRIER LOWPRO .400 28POS

Mill-Max Manufacturing Corp.

2270 16.31
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Немедленный

614-93-428-31-012000

Datenblatt

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-428-31-012000

614-43-428-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2239 16.31
- +

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Немедленный

614-43-428-31-012000

Datenblatt

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-328-41-004000

612-43-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2385 16.31
- +

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Немедленный

612-43-328-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-428-41-004000

612-43-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3210 16.31
- +

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Немедленный

612-43-428-41-004000

Datenblatt

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-628-41-004000

612-43-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2893 16.31
- +

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Немедленный

612-43-628-41-004000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-328-41-004000

612-93-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2835 16.31
- +

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Немедленный

612-93-328-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-428-41-004000

612-93-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3498 16.31
- +

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Немедленный

612-93-428-41-004000

Datenblatt

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-628-41-004000

612-93-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2986 16.31
- +

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Немедленный

612-93-628-41-004000

Datenblatt

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-642-31-002000

614-41-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2435 16.31
- +

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Немедленный

614-41-642-31-002000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-642-31-002000

614-91-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3215 16.31
- +

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Немедленный

614-91-642-31-002000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-318-41-004000

612-43-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2770 16.32
- +

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Немедленный

612-43-318-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-318-41-004000

612-93-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2206 16.32
- +

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Немедленный

612-93-318-41-004000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
TMJ03DKSD-S1512

TMJ03DKSD-S1512

CONN TRANSIST TO-254 3POS GOLD

Sullins Connector Solutions

2719 16.32
- +

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Немедленный

TMJ03DKSD-S1512

Datenblatt

Tray - Active Transistor, TO-254 3 (Rectangular) 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Flange Solder 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
605-93-640-11-480000

605-93-640-11-480000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2978 16.33
- +

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Немедленный

605-93-640-11-480000

Datenblatt

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-640-11-480000

605-43-640-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2734 16.33
- +

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Немедленный

605-43-640-11-480000

Datenblatt

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
23-7400-10

23-7400-10

CONN SOCKET SIP 23POS TIN

Aries Electronics

2736 16.33
- +

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Немедленный

23-7400-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 23 (1 x 23) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-20

34-3503-20

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3478 16.33
- +

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Немедленный

34-3503-20

Datenblatt

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-3503-30

34-3503-30

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3181 16.33
- +

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Немедленный

34-3503-30

Datenblatt

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
81-PGM09001-10

81-PGM09001-10

CONN SOCKET PGA GOLD

Aries Electronics

3472 16.33
- +

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Немедленный

81-PGM09001-10

Datenblatt

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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