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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-41-632-41-007000

116-41-632-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2387 16.23
- +

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Немедленный

116-41-632-41-007000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-432-41-007000

116-91-432-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2401 16.23
- +

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Немедленный

116-91-432-41-007000

Datenblatt

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-632-41-007000

116-91-632-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2841 16.23
- +

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Немедленный

116-91-632-41-007000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-640-31-007000

614-93-640-31-007000

SOCKET CARRIER LOWPRO .600 40POS

Mill-Max Manufacturing Corp.

3005 16.23
- +

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Немедленный

614-93-640-31-007000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-640-31-007000

614-43-640-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2500 16.23
- +

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Немедленный

614-43-640-31-007000

Datenblatt

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-652-41-003000

116-41-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3486 16.23
- +

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Немедленный

116-41-652-41-003000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-652-41-003000

116-91-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3931 16.23
- +

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Немедленный

116-91-652-41-003000

Datenblatt

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-322-41-002000

126-41-322-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3194 16.24
- +

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Немедленный

126-41-322-41-002000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-422-41-002000

126-41-422-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2180 16.24
- +

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Немедленный

126-41-422-41-002000

Datenblatt

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-322-41-002000

126-91-322-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3317 16.24
- +

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Немедленный

126-91-322-41-002000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-422-41-002000

126-91-422-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2045 16.24
- +

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Немедленный

126-91-422-41-002000

Datenblatt

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-640-41-105000

110-93-640-41-105000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2272 16.24
- +

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Немедленный

110-93-640-41-105000

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-640-41-105000

110-43-640-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3228 16.24
- +

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Немедленный

110-43-640-41-105000

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-328-41-780000

104-11-328-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3321 16.24
- +

Добавить

Немедленный

104-11-328-41-780000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-428-41-780000

104-11-428-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2922 16.24
- +

Добавить

Немедленный

104-11-428-41-780000

Datenblatt

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-628-41-780000

104-11-628-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2646 16.24
- +

Добавить

Немедленный

104-11-628-41-780000

Datenblatt

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-952-41-006000

116-41-952-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2464 16.25
- +

Добавить

Немедленный

116-41-952-41-006000

Datenblatt

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-952-41-006000

116-91-952-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2383 16.25
- +

Добавить

Немедленный

116-91-952-41-006000

Datenblatt

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-3508-202

28-3508-202

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2521 16.25
- +

Добавить

Немедленный

28-3508-202

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-302

28-3508-302

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3456 16.25
- +

Добавить

Немедленный

28-3508-302

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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