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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
20-823-90TWRCONN IC DIP SOCKET 20POS TIN |
3148 | 11.07 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
|
22-6823-90TCONN IC DIP SOCKET 22POS TIN |
2816 | 11.07 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
714-43-141-31-018000CONN SOCKET SIP 41POS GOLD |
2637 | 11.08 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 714 | Active | SIP | 41 (1 x 41) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-47-310-41-001000STANDRD SOLDRTL |
2737 | 11.10 |
ДобавитьНемедленный |
Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
16-0501-20CONN SOCKET SIP 16POS TIN |
3773 | 11.11 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-0501-30CONN SOCKET SIP 16POS TIN |
2654 | 11.11 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
11-0501-21CONN SOCKET SIP 11POS GOLD |
3951 | 11.11 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
11-0501-31CONN SOCKET SIP 11POS GOLD |
3795 | 11.11 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-320-G-A1ADAPTER PLUG |
3119 | 11.11 |
ДобавитьНемедленный |
Bulk | APA | Active | - | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
614-87-100-13-062112CONN SOCKET PGA 100POS GOLD |
2210 | 10.59 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 614 | Active | PGA | 100 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
714-43-143-31-018000CONN SOCKET SIP 43POS GOLD |
3694 | 11.12 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 714 | Active | SIP | 43 (1 x 43) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
ICF-632-S-OCONN IC DIP SOCKET 32POS TIN |
3839 | 11.13 |
ДобавитьНемедленный |
Datenblatt |
Tube | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
|
210-47-310-41-001000STANDRD SOLDRTL DBL SKT |
2113 | 11.13 |
ДобавитьНемедленный |
Datenblatt |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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|
346-93-161-41-013000CONN SOCKET SIP 61POS GOLD |
3049 | 11.16 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 346 | Active | SIP | 61 (1 x 61) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-43-161-41-013000CONN SOCKET SIP 61POS GOLD |
2906 | 11.16 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 346 | Active | SIP | 61 (1 x 61) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
1107659-01700 ELEVATOR STRIP-LINE SOCKET |
3382 | 11.17 |
ДобавитьНемедленный |
Datenblatt |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
32-9513-11CONN IC DIP SOCKET 32POS GOLD |
2193 | 11.17 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-3513-10HCONN IC DIP SOCKET 34POS GOLD |
2817 | 11.17 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 34 (2 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-C182-11HCONN IC DIP SOCKET 24POS GOLD |
3507 | 11.17 |
ДобавитьНемедленный |
Datenblatt |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
36-3513-11CONN IC DIP SOCKET 36POS GOLD |
3082 | 11.19 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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