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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
09-7970-11CONN SOCKET SIP 9POS GOLD |
3261 | 11.02 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-0508-20CONN SOCKET SIP 24POS GOLD |
3174 | 11.02 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
24-0508-30CONN SOCKET SIP 24POS GOLD |
2086 | 11.02 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
24-1508-20CONN IC DIP SOCKET 24POS GOLD |
2910 | 11.02 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
24-1508-30CONN IC DIP SOCKET 24POS GOLD |
2289 | 11.02 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
40-6501-30CONN IC DIP SOCKET 40POS TIN |
2718 | 11.03 |
ДобавитьНемедленный |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
|
|
14-0503-21CONN SOCKET SIP 14POS GOLD |
2722 | 11.03 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 0503 | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
14-0503-31CONN SOCKET SIP 14POS GOLD |
3455 | 11.03 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 0503 | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
16-6501-21CONN IC DIP SOCKET 16POS GOLD |
3108 | 11.03 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-6501-31CONN IC DIP SOCKET 16POS GOLD |
3175 | 11.03 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-6501-20CONN IC DIP SOCKET 40POS TIN |
2550 | 11.03 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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|
346-93-163-41-013000CONN SOCKET SIP 63POS GOLD |
3226 | 11.03 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 346 | Active | SIP | 63 (1 x 63) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-43-163-41-013000CONN SOCKET SIP 63POS GOLD |
2482 | 11.03 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 346 | Active | SIP | 63 (1 x 63) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
08-3508-21CONN IC DIP SOCKET 8POS GOLD |
2729 | 11.04 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-3508-31CONN IC DIP SOCKET 8POS GOLD |
2200 | 11.04 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
110-99-310-41-001000CONN IC DIP SOCKET 10POS TINLEAD |
2811 | 11.04 |
ДобавитьНемедленный |
Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-44-310-41-001000CONN IC SKT DBL |
3458 | 11.04 |
ДобавитьНемедленный |
Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-41-304-61-001000CONN IC SKT DBL |
2857 | 11.05 |
ДобавитьНемедленный |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-91-304-61-001000CONN IC SKT DBL |
3909 | 11.05 |
ДобавитьНемедленный |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
20-822-90TWRCONN IC DIP SOCKET 20POS TIN |
2975 | 11.07 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
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