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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-91-628-41-001000

110-91-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3171 9.09
- +

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Немедленный

110-91-628-41-001000

Datenblatt

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-306-41-001000

110-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

3440 9.09
- +

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Немедленный

110-93-306-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-306-41-001000

110-99-306-41-001000

CONN IC DIP SOCKET 6POS TIN-LEAD

Mill-Max Manufacturing Corp.

3690 9.09
- +

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Немедленный

110-99-306-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-306-41-001000

110-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2128 9.09
- +

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Немедленный

110-41-306-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-314-G-M

APA-314-G-M

ADAPTER PLUG

Samtec Inc.

3569 9.09
- +

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Немедленный

Tube APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
40-6513-11

40-6513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3464 9.11
- +

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Немедленный

40-6513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-11

26-3513-11

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2610 9.11
- +

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Немедленный

26-3513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-93-624-10-002000

299-93-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2659 9.12
- +

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Немедленный

299-93-624-10-002000

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-624-10-002000

299-43-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3466 9.12
- +

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Немедленный

299-43-624-10-002000

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
29-0511-10

29-0511-10

CONN SOCKET SIP 29POS TIN

Aries Electronics

3353 9.13
- +

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Немедленный

29-0511-10

Datenblatt

Bulk 511 Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4513-11H

22-4513-11H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2369 9.13
- +

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Немедленный

22-4513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3503-20

18-3503-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3783 9.13
- +

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Немедленный

18-3503-20

Datenblatt

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3503-30

18-3503-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3808 9.13
- +

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Немедленный

18-3503-30

Datenblatt

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-0511-10

40-0511-10

CONN SOCKET SIP 40POS TIN

Aries Electronics

3692 9.13
- +

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Немедленный

40-0511-10

Datenblatt

Bulk 511 Active SIP 40 (1 x 40) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-642-41-004101

116-83-642-41-004101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3037 8.64
- +

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Немедленный

116-83-642-41-004101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-150-41-013000

346-93-150-41-013000

CONN SOCKET SIP 50POS GOLD

Mill-Max Manufacturing Corp.

2106 9.15
- +

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Немедленный

346-93-150-41-013000

Datenblatt

Bulk 346 Active SIP 50 (1 x 50) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-150-41-013000

346-43-150-41-013000

CONN SOCKET SIP 50POS GOLD

Mill-Max Manufacturing Corp.

3422 9.15
- +

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Немедленный

346-43-150-41-013000

Datenblatt

Bulk 346 Active SIP 50 (1 x 50) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-822-90T

14-822-90T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2789 9.18
- +

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Немедленный

14-822-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-6820-90TWR

18-6820-90TWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3682 9.18
- +

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Немедленный

18-6820-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-134-31-018000

714-43-134-31-018000

CONN SOCKET SIP 34POS GOLD

Mill-Max Manufacturing Corp.

2044 9.19
- +

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Немедленный

714-43-134-31-018000

Datenblatt

Bulk 714 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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