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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-182-18-091101

510-83-182-18-091101

CONN SOCKET PGA 182POS GOLD

Preci-Dip

3349 8.40
- +

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Немедленный

510-83-182-18-091101

Datenblatt

Bulk 510 Active PGA 182 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-91-304-41-001000

116-91-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3663 8.86
- +

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Немедленный

116-91-304-41-001000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-0511-10

32-0511-10

CONN SOCKET SIP 32POS TIN

Aries Electronics

2265 8.87
- +

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Немедленный

32-0511-10

Datenblatt

Bulk 511 Active SIP 32 (1 x 32) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-0518-00

36-0518-00

CONN SOCKET SIP 36POS GOLD

Aries Electronics

2338 8.87
- +

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Немедленный

36-0518-00

Datenblatt

Bulk 518 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-1518-00

36-1518-00

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2893 8.87
- +

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Немедленный

36-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-87-084-10-001112

614-87-084-10-001112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3451 8.40
- +

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Немедленный

614-87-084-10-001112

Datenblatt

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-084-10-031112

614-87-084-10-031112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2576 8.40
- +

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Немедленный

614-87-084-10-031112

Datenblatt

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-3501-21

16-3501-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2528 8.89
- +

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Немедленный

16-3501-21

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3501-31

16-3501-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2913 8.89
- +

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Немедленный

16-3501-31

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-0511-10

28-0511-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

2982 8.89
- +

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Немедленный

28-0511-10

Datenblatt

Bulk 511 Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-10H

24-C182-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2170 8.89
- +

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Немедленный

24-C182-10H

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-6810-90T

08-6810-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3903 8.89
- +

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Немедленный

08-6810-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
12-6820-90C

12-6820-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3008 8.89
- +

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Немедленный

12-6820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6822-90C

12-6822-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3327 8.89
- +

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Немедленный

12-6822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6823-90C

12-6823-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3614 8.89
- +

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Немедленный

12-6823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-628-T-N

APA-628-T-N

ADAPTER PLUG

Samtec Inc.

2086 8.89
- +

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Немедленный

Tube APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-87-650-41-004101

116-87-650-41-004101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3591 8.43
- +

Добавить

Немедленный

116-87-650-41-004101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-17-001101

510-83-181-17-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3695 8.39
- +

Добавить

Немедленный

510-83-181-17-001101

Datenblatt

Bulk 510 Active PGA 181 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-6511-11

14-6511-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3704 8.91
- +

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Немедленный

14-6511-11

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
299-87-636-10-002101

299-87-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3434 8.43
- +

Добавить

Немедленный

299-87-636-10-002101

Datenblatt

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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