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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-0508-20

18-0508-20

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3134 8.33
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18-0508-20

Datenblatt

Bulk 508 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
18-0508-30

18-0508-30

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3244 8.33
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18-0508-30

Datenblatt

Bulk 508 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
18-1508-20

18-1508-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2821 8.33
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18-1508-20

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
18-1508-30

18-1508-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2370 8.33
- +

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18-1508-30

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
24-3518-112

24-3518-112

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3386 8.33
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24-3518-112

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-112

24-6518-112

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3823 8.33
- +

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24-6518-112

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-6820-90T

18-6820-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

2957 8.33
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18-6820-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-228-31-018000

714-43-228-31-018000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3313 8.34
- +

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714-43-228-31-018000

Datenblatt

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-0511-10

24-0511-10

CONN SOCKET SIP 24POS TIN

Aries Electronics

3696 8.36
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24-0511-10

Datenblatt

Bulk 511 Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-2822-90T

10-2822-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

2542 8.36
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10-2822-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
10-2823-90T

10-2823-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3619 8.36
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Немедленный

10-2823-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
10-6501-21

10-6501-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2472 8.36
- +

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10-6501-21

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6501-31

10-6501-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3500 8.36
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Немедленный

10-6501-31

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
07-0501-21

07-0501-21

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2085 8.36
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07-0501-21

Datenblatt

Bulk 501 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
07-0501-31

07-0501-31

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3924 8.36
- +

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Немедленный

07-0501-31

Datenblatt

Bulk 501 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
540-AG10D-ES

540-AG10D-ES

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

3829 8.37
- +

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540-AG10D-ES

Datenblatt

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
714-43-131-31-018000

714-43-131-31-018000

CONN SOCKET SIP 31POS GOLD

Mill-Max Manufacturing Corp.

3367 8.38
- +

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Немедленный

714-43-131-31-018000

Datenblatt

Bulk 714 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-308-G-B

APA-308-G-B

ADAPTER PLUG

Samtec Inc.

3062 8.39
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Bulk APA Active - 8 (2 x 4) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
346-93-146-41-013000

346-93-146-41-013000

CONN SOCKET SIP 46POS GOLD

Mill-Max Manufacturing Corp.

3209 8.42
- +

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Немедленный

346-93-146-41-013000

Datenblatt

Bulk 346 Active SIP 46 (1 x 46) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-146-41-013000

346-43-146-41-013000

CONN SOCKET SIP 46POS GOLD

Mill-Max Manufacturing Corp.

2858 8.42
- +

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Немедленный

346-43-146-41-013000

Datenblatt

Bulk 346 Active SIP 46 (1 x 46) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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