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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
33-0518-00

33-0518-00

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2862 8.09
- +

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33-0518-00

Datenblatt

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
546-87-085-11-002135

546-87-085-11-002135

CONN SOCKET PGA 85POS GOLD

Preci-Dip

2487 7.68
- +

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Немедленный

546-87-085-11-002135

Datenblatt

Bulk 546 Active PGA 85 (11 x 11) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-085-11-002136

546-87-085-11-002136

CONN SOCKET PGA 85POS GOLD

Preci-Dip

3852 7.68
- +

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Немедленный

546-87-085-11-002136

Datenblatt

Bulk 546 Active PGA 85 (11 x 11) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-304-31-002000

614-41-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3797 8.10
- +

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Немедленный

614-41-304-31-002000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-304-31-002000

614-91-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3428 8.10
- +

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Немедленный

614-91-304-31-002000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
528-AG11D

528-AG11D

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

3752 8.10
- +

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Немедленный

528-AG11D

Datenblatt

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
614-93-304-31-012000

614-93-304-31-012000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

3749 8.11
- +

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Немедленный

614-93-304-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-304-31-012000

614-43-304-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2460 8.11
- +

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Немедленный

614-43-304-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-3518-111

28-3518-111

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3056 8.11
- +

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Немедленный

28-3518-111

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-111

28-6518-111

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3898 8.11
- +

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Немедленный

28-6518-111

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0517-90C

19-0517-90C

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2320 8.11
- +

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Немедленный

19-0517-90C

Datenblatt

Bulk 0517 Active SIP 19 (1 x 19) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-130-31-018000

714-43-130-31-018000

CONN SOCKET SIP 30POS GOLD

Mill-Max Manufacturing Corp.

3909 8.11
- +

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Немедленный

714-43-130-31-018000

Datenblatt

Bulk 714 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-314-G-A1

APA-314-G-A1

ADAPTER PLUG

Samtec Inc.

2586 8.11
- +

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Немедленный

Bulk APA Active - 14 (2 x 7) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-83-156-15-061101

510-83-156-15-061101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

3200 7.70
- +

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Немедленный

510-83-156-15-061101

Datenblatt

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-156-15-062101

510-83-156-15-062101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

2244 7.70
- +

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Немедленный

510-83-156-15-062101

Datenblatt

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-156-16-001101

510-83-156-16-001101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

3619 7.70
- +

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Немедленный

510-83-156-16-001101

Datenblatt

Bulk 510 Active PGA 156 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-156-16-091101

510-83-156-16-091101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

3365 7.70
- +

Добавить

Немедленный

510-83-156-16-091101

Datenblatt

Bulk 510 Active PGA 156 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-93-304-31-018000

614-93-304-31-018000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

3967 8.12
- +

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Немедленный

614-93-304-31-018000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-304-31-018000

614-43-304-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3742 8.12
- +

Добавить

Немедленный

614-43-304-31-018000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-3513-10H

24-3513-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2807 8.13
- +

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Немедленный

24-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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