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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NTE417SOCKET-3-PIN TO-18 |
3444 | 4.50 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Active | Transistor, TO-18 and TO-92 | 3 (Round) | - | - | - | - | - | - | Solder | - | - | - | - | - |
|
ICF-628-T-OCONN IC DIP SOCKET 28POS TIN |
245 | 4.92 |
ДобавитьНемедленный |
Datenblatt |
Tube | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICA-324-SST.100 SCREW MACHINE DIP SOCKET |
930 | 5.10 |
ДобавитьНемедленный |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
ICO-320-SGTCONN IC DIP SOCKET 20POS GOLD |
840 | 5.15 |
ДобавитьНемедленный |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
ICA-632-SSTCONN IC DIP SOCKET 32POS GOLD |
364 | 6.52 |
ДобавитьНемедленный |
Datenblatt |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
|
ICA-316-ZAGTCONN IC DIP SOCKET 16POS GOLD |
163 | 6.59 |
ДобавитьНемедленный |
Datenblatt |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled |
|
ICO-316-NGT100 LOW PROFILE SCREW MACHINE D |
249 | 6.62 |
ДобавитьНемедленный |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | |
|
APA-316-G-A1ADAPTER PLUG |
200 | 8.89 |
ДобавитьНемедленный |
Bulk | APA | Active | - | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
D8864-42CONN IC DIP SOCKET 64POS GOLD |
432 | 10.34 |
ДобавитьНемедленный |
Datenblatt |
Tube | D8864 | Active | DIP, 0.75 (19.05mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
ICO-628-NGTCONN IC DIP SOCKET 28POS GOLD |
121 | 11.08 |
ДобавитьНемедленный |
Datenblatt |
Tube | ICO | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
48-6554-11CONN IC DIP SOCKET ZIF 48POS GLD |
620 | 32.61 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
115-47-308-41-003000CONN IC DIP SOCKET 8POS GOLD |
1377 | 0.88 |
ДобавитьНемедленный |
Datenblatt |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
114-87-310-41-134191CONN IC DIP SOCKET 10POS GOLD |
1998 | 1.15 |
ДобавитьНемедленный |
Tape & Reel (TR),Cut Tape (CT) | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
4-1571552-2CONN IC DIP SOCKET 14POS GOLD |
1704 | 1.61 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
808-AG11D-LFCONN IC DIP SOCKET 8POS GOLD |
2657 | 1.77 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-1571551-2CONN IC DIP SOCKET 8POS GOLD |
4214 | 2.07 |
ДобавитьНемедленный |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
69802-144LFCONN SOCKET PLCC 44POS TIN |
2485 | 2.65 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
520-AG11D-ESDIP SOCKET T/H 20POS |
867 | 3.55 |
ДобавитьНемедленный |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
14-8870-10CONN IC DIP SOCKET 14POS TIN |
700 | 3.86 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
4-1571552-6CONN IC DIP SOCKET 20POS GOLD |
1786 | 3.95 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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