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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
211-1-06-003CONN IC DIP SOCKET 6POS GOLD |
8006 | 0.71 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
211-1-08-003CONN IC DIP SOCKET 8POS GOLD |
5796 | 0.79 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
DILB24P-224TLFCONN IC DIP SOCKET 24POS TINLEAD |
10853 | 0.85 |
ДобавитьНемедленный |
Datenblatt |
Tube | DILB | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
211-1-14-003CONN IC DIP SOCKET 14POS GOLD |
2554 | 0.97 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
D01-9970742CONN SOCKET SIP 7POS GOLD |
4797 | 0.98 |
ДобавитьНемедленный |
Datenblatt |
Tube | D01-997 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9971242CONN SOCKET SIP 12POS GOLD |
4700 | 1.08 |
ДобавитьНемедленный |
Datenblatt |
Tube | D01-997 | Active | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
211-1-16-003CONN IC DIP SOCKET 16POS GOLD |
2759 | 1.23 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
211-1-18-003CONN IC DIP SOCKET 18POS GOLD |
2790 | 1.36 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
ICA-308-STTCONN IC DIP SOCKET 8POS TIN |
3040 | 1.50 |
ДобавитьНемедленный |
Datenblatt |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
211-1-20-003CONN IC DIP SOCKET 20POS GOLD |
1281 | 1.53 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
1050281001CONN CAM SOCKET 32POS GOLD |
21667 | 2.25 |
ДобавитьНемедленный |
Datenblatt |
Tape & Reel (TR),Cut Tape (CT) | 105028 | Active | Camera Socket | 32 (4 x 8) | 0.035 (0.90mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Nickel | 50.0µin (1.27µm) | Copper Alloy | Thermoplastic |
|
211-1-24-006CONN IC DIP SOCKET 24POS GOLD |
1307 | 1.66 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
211-1-28-006CONN IC DIP SOCKET 28POS GOLD |
1315 | 1.83 |
ДобавитьНемедленный |
Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
NTE435K64SOCKET-64 PIN DIP .070 |
296 | 1.93 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - |
|
ICA-318-STTCONN IC DIP SOCKET 18POS TIN |
1054 | 2.59 |
ДобавитьНемедленный |
Datenblatt |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
NTE419SOCKET-3-PIN TO-5 |
600 | 2.88 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Active | Transistor, TO-5 and TO-39 | 3 (Round) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE209SOCKET TO-3 PWR |
267 | 3.28 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Active | Transistor, TO-3 | 2 (1 x 2) | - | - | - | - | Through Hole | - | - | - | - | - | - | - |
|
NTE435K52SOCKET-52 PIN DIP .070 |
1116 | 3.43 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Active | DIP, 0.698 (17.72mm) Row Spacing | 52 (2 x 26) | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - |
|
ICF-328-T-O-TR.100 SURFACE MOUNT SCREW MACHIN |
350 | 3.45 |
ДобавитьНемедленный |
Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | |
|
NTE436W2828-PIN DIP IC SOCKET |
296 | 3.98 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | - | - | - | - | Through Hole | - | Wire Wrap | - | - | - | - | - |
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