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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
08-2511-10

08-2511-10

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3187 2.57
- +

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Немедленный

08-2511-10

Datenblatt

Bulk 511 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-0513-10

16-0513-10

CONN SOCKET SIP 16POS GOLD

Aries Electronics

3993 2.57
- +

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Немедленный

16-0513-10

Datenblatt

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0518-10H

19-0518-10H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2406 2.57
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Немедленный

19-0518-10H

Datenblatt

Bulk 518 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-632-41-001101

614-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2049 2.41
- +

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Немедленный

614-83-632-41-001101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-018101

116-87-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3026 2.41
- +

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Немедленный

116-87-636-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-424-41-001101

121-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2985 2.65
- +

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Немедленный

121-83-424-41-001101

Datenblatt

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-624-41-001101

121-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3848 2.42
- +

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Немедленный

121-83-624-41-001101

Datenblatt

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-308-T-N

APA-308-T-N

ADAPTER PLUG

Samtec Inc.

2284 2.58
- +

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Немедленный

Tube APA Active - 8 (2 x 4) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
346-93-112-41-013000

346-93-112-41-013000

CONN SOCKET SIP 12POS GOLD

Mill-Max Manufacturing Corp.

3878 2.58
- +

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Немедленный

346-93-112-41-013000

Datenblatt

Bulk 346 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-112-41-013000

346-43-112-41-013000

CONN SOCKET SIP 12POS GOLD

Mill-Max Manufacturing Corp.

2535 2.58
- +

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Немедленный

346-43-112-41-013000

Datenblatt

Bulk 346 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-113-41-013000

346-93-113-41-013000

CONN SOCKET SIP 13POS GOLD

Mill-Max Manufacturing Corp.

3044 2.59
- +

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Немедленный

346-93-113-41-013000

Datenblatt

Bulk 346 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-113-41-013000

346-43-113-41-013000

CONN SOCKET SIP 13POS GOLD

Mill-Max Manufacturing Corp.

3614 2.59
- +

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Немедленный

346-43-113-41-013000

Datenblatt

Bulk 346 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-208-31-018000

714-43-208-31-018000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2937 2.59
- +

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Немедленный

714-43-208-31-018000

Datenblatt

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-056-09-041101

510-83-056-09-041101

CONN SOCKET PGA 56POS GOLD

Preci-Dip

3844 2.43
- +

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Немедленный

510-83-056-09-041101

Datenblatt

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-011101

116-87-420-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2408 2.43
- +

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Немедленный

116-87-420-41-011101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-008101

116-83-422-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2507 2.43
- +

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Немедленный

116-83-422-41-008101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-640-41-001101

612-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3313 2.43
- +

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Немедленный

612-87-640-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-011101

116-87-322-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3044 2.44
- +

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Немедленный

116-87-322-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-002101

116-87-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3280 2.44
- +

Добавить

Немедленный

116-87-624-41-002101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-007101

116-87-428-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3268 2.44
- +

Добавить

Немедленный

116-87-428-41-007101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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