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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-422-41-007101

116-83-422-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3340 2.28
- +

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Немедленный

116-83-422-41-007101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
15-0513-10

15-0513-10

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3244 2.44
- +

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Немедленный

15-0513-10

Datenblatt

Bulk 0513 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-00

11-0518-00

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2201 2.44
- +

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Немедленный

11-0518-00

Datenblatt

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0518-10H

18-0518-10H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3271 2.44
- +

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Немедленный

18-0518-10H

Datenblatt

Bulk 518 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-1518-10H

18-1518-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3753 2.44
- +

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Немедленный

18-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-87-636-31-012101

614-87-636-31-012101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2952 2.51
- +

Добавить

Немедленный

614-87-636-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-003101

116-83-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3501 2.29
- +

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Немедленный

116-83-328-41-003101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-628-41-035101

146-87-628-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2650 2.45
- +

Добавить

Немедленный

146-87-628-41-035101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-628-41-036101

146-87-628-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2747 2.45
- +

Добавить

Немедленный

146-87-628-41-036101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-428-41-035101

146-87-428-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3786 2.30
- +

Добавить

Немедленный

146-87-428-41-035101

Datenblatt

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-428-41-036101

146-87-428-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2688 2.30
- +

Добавить

Немедленный

146-87-428-41-036101

Datenblatt

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-312-10-001101

299-83-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2082 2.30
- +

Добавить

Немедленный

299-83-312-10-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-652-41-005101

117-87-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2347 2.30
- +

Добавить

Немедленный

117-87-652-41-005101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-003101

116-83-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3486 2.30
- +

Добавить

Немедленный

116-83-424-41-003101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-648-41-003101

115-87-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2391 2.31
- +

Добавить

Немедленный

115-87-648-41-003101

Datenblatt

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-076-11-041101

510-87-076-11-041101

CONN SOCKET PGA 76POS GOLD

Preci-Dip

3498 2.29
- +

Добавить

Немедленный

510-87-076-11-041101

Datenblatt

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-11-002101

510-87-084-11-002101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2315 2.53
- +

Добавить

Немедленный

510-87-084-11-002101

Datenblatt

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-11-041101

510-87-084-11-041101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3082 2.53
- +

Добавить

Немедленный

510-87-084-11-041101

Datenblatt

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-11-042101

510-87-084-11-042101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2465 2.53
- +

Добавить

Немедленный

510-87-084-11-042101

Datenblatt

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-10-001101

510-87-084-10-001101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3080 2.31
- +

Добавить

Немедленный

510-87-084-10-001101

Datenblatt

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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