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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-83-624-41-105101

117-83-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2032 2.04
- +

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Немедленный

117-83-624-41-105101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-801101

110-83-318-41-801101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3084 2.04
- +

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Немедленный

110-83-318-41-801101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-642-41-001101

115-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3328 2.04
- +

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Немедленный

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-3513-00

08-3513-00

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3385 2.18
- +

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Немедленный

08-3513-00

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0513-11

10-0513-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2940 2.18
- +

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Немедленный

10-0513-11

Datenblatt

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0513-10T

14-0513-10T

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2548 2.20
- +

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Немедленный

14-0513-10T

Datenblatt

Bulk 0513 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-11H

07-0518-11H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3918 2.20
- +

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Немедленный

07-0518-11H

Datenblatt

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0518-10

18-0518-10

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3947 2.20
- +

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Немедленный

18-0518-10

Datenblatt

Bulk 518 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3511-10WR

14-3511-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3979 2.21
- +

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Немедленный

14-3511-10WR

Datenblatt

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-4513-11

08-4513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2054 2.21
- +

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Немедленный

08-4513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0518-00

10-0518-00

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2335 2.21
- +

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Немедленный

10-0518-00

Datenblatt

Bulk 518 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-00

10-1518-00

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3511 2.21
- +

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Немедленный

10-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-11

13-0518-11

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2553 2.21
- +

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Немедленный

13-0518-11

Datenblatt

Bulk 518 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0518-10H

16-0518-10H

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2229 2.21
- +

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Немедленный

16-0518-10H

Datenblatt

Bulk 518 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-1518-10H

16-1518-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3486 2.21
- +

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Немедленный

16-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0518-10

19-0518-10

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2745 2.21
- +

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Немедленный

19-0518-10

Datenblatt

Bulk 518 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-308-T-A

APA-308-T-A

ADAPTER PLUG

Samtec Inc.

3267 2.21
- +

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Немедленный

Bulk APA Active - 8 (2 x 4) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-83-316-41-011101

116-83-316-41-011101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2100 2.06
- +

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Немедленный

116-83-316-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-008101

116-83-320-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2698 2.07
- +

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Немедленный

116-83-320-41-008101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-107-31-018000

714-43-107-31-018000

CONN SOCKET SIP 7POS GOLD

Mill-Max Manufacturing Corp.

3191 2.22
- +

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Немедленный

714-43-107-31-018000

Datenblatt

Bulk 714 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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