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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
121-83-322-41-001101

121-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3000 2.00
- +

Добавить

Немедленный

121-83-322-41-001101

Datenblatt

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-012101

116-83-422-41-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2028 2.14
- +

Добавить

Немедленный

116-83-422-41-012101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-428-41-105101

110-87-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3138 2.20
- +

Добавить

Немедленный

110-87-428-41-105101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-002101

116-87-424-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3606 2.20
- +

Добавить

Немедленный

116-87-424-41-002101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-632-41-117101

114-83-632-41-117101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2616 2.00
- +

Добавить

Немедленный

114-83-632-41-117101

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-632-41-134161

114-83-632-41-134161

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2263 2.00
- +

Добавить

Немедленный

114-83-632-41-134161

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-308-T-A1

APA-308-T-A1

ADAPTER PLUG

Samtec Inc.

3466 2.13
- +

Добавить

Немедленный

Bulk APA Active - 8 (2 x 4) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APO-308-T-A

APO-308-T-A

.100 LOW PROFILE SCREW MACHINE

Samtec Inc.

2543 2.13
- +

Добавить

Немедленный

Bulk APO Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-83-424-41-018101

116-83-424-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2316 2.20
- +

Добавить

Немедленный

116-83-424-41-018101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-632-41-134191

114-83-632-41-134191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3952 2.05
- +

Добавить

Немедленный

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-073-11-061101

510-87-073-11-061101

CONN SOCKET PGA 73POS GOLD

Preci-Dip

2811 2.20
- +

Добавить

Немедленный

510-87-073-11-061101

Datenblatt

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-2513-11

06-2513-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2197 2.13
- +

Добавить

Немедленный

06-2513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6513-10

10-6513-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2555 2.13
- +

Добавить

Немедленный

10-6513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0518-11

12-0518-11

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2183 2.13
- +

Добавить

Немедленный

12-0518-11

Datenblatt

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-11

12-1518-11

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3251 2.13
- +

Добавить

Немедленный

12-1518-11

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-1518-10T

16-1518-10T

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3706 2.13
- +

Добавить

Немедленный

16-1518-10T

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-83-322-41-001101

122-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2779 2.15
- +

Добавить

Немедленный

122-83-322-41-001101

Datenblatt

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-422-41-001101

122-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2773 2.15
- +

Добавить

Немедленный

122-83-422-41-001101

Datenblatt

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-322-41-001101

123-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3532 2.15
- +

Добавить

Немедленный

123-83-322-41-001101

Datenblatt

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-422-41-001101

123-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3338 2.15
- +

Добавить

Немедленный

123-83-422-41-001101

Datenblatt

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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