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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESQ-114-14-G-S

ESQ-114-14-G-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 2893 6.43
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Немедленный

 ESQ-114-14-G-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-114-48-G-S

ESW-114-48-G-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 2543 6.43
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Немедленный

 ESW-114-48-G-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-114-48-S-S

ESW-114-48-S-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 2036 6.43
- +

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Немедленный

 ESW-114-48-S-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-113-33-S-S

ESQ-113-33-S-S

CONN SOCKET 13POS 0.1 GOLD PCB

Samtec Inc.

 2549 6.43
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Немедленный

 ESQ-113-33-S-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 13 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-115-23-T-D-LL

ESQ-115-23-T-D-LL

CONN SOCKET 30POS 0.1 TIN PCB

Samtec Inc.

 2638 6.43
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Немедленный

 ESQ-115-23-T-D-LL

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 30 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.190 (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESW-132-12-T-S

ESW-132-12-T-S

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc.

 3542 6.43
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Немедленный

 ESW-132-12-T-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 32 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-118-12-T-D

ESQ-118-12-T-D

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.

 3796 6.45
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Немедленный

 ESQ-118-12-T-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 36 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-108-38-S-D

ESQ-108-38-S-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 2356 6.45
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Немедленный

 ESQ-108-38-S-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-108-33-S-D

ESQ-108-33-S-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 2392 6.45
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Немедленный

 ESQ-108-33-S-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-108-69-L-D

ESQ-108-69-L-D

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 2889 6.45
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Немедленный

 ESQ-108-69-L-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735 (18.67mm) 0.180 (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-110-13-G-D

ESW-110-13-G-D

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc.

 3272 6.45
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Немедленный

 ESW-110-13-G-D

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-108-24-S-D-LL

ESW-108-24-S-D-LL

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 3691 6.45
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Немедленный

 ESW-108-24-S-D-LL

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-110-39-L-D

ESW-110-39-L-D

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc.

 2638 6.45
- +

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Немедленный

 ESW-110-39-L-D

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-111-33-L-D

ESW-111-33-L-D

CONN SOCKET 22POS 0.1 GOLD PCB

Samtec Inc.

 2117 6.45
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Немедленный

 ESW-111-33-L-D

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 22 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-114-58-G-S

ESW-114-58-G-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 2672 6.45
- +

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Немедленный

 ESW-114-58-G-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-114-34-G-S

ESW-114-34-G-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 3011 6.45
- +

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Немедленный

 ESW-114-34-G-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-117-13-G-S

ESW-117-13-G-S

CONN SOCKET 17POS 0.1 GOLD PCB

Samtec Inc.

 3036 6.45
- +

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Немедленный

 ESW-117-13-G-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 17 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESW-113-33-F-D

ESW-113-33-F-D

CONN SOCKET 26POS 0.1 GOLD PCB

Samtec Inc.

 2150 6.45
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Немедленный

 ESW-113-33-F-D

Datenblatt

 Bulk ESW Active Elevated Socket Forked Board to Board 26 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-119-13-L-S

ESQ-119-13-L-S

CONN SOCKET 19POS 0.1 GOLD PCB

Samtec Inc.

 3639 6.45
- +

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Немедленный

 ESQ-119-13-L-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 19 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-136-13-T-S

ESQ-136-13-T-S

CONN SOCKET 36POS 0.1 TIN PCB

Samtec Inc.

 3746 6.45
- +

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Немедленный

 ESQ-136-13-T-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 105°C UL94 V-0 Tin - -
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