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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
ESW-116-34-L-S

ESW-116-34-L-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

 2885 6.35
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Немедленный

 ESW-116-34-L-S

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 16 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESQ-116-13-T-D

ESQ-116-13-T-D

CONN SOCKET 32POS 0.1 TIN PCB

Samtec Inc.

 2671 6.35
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 ESQ-116-13-T-D

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 32 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESW-115-24-T-D

ESW-115-24-T-D

CONN SOCKET 30POS 0.1 TIN PCB

Samtec Inc.

 2700 6.35
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 ESW-115-24-T-D

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 30 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-120-12-L-S

ESQ-120-12-L-S

CONN SOCKET 20POS 0.1 GOLD PCB

Samtec Inc.

 3484 6.35
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 ESQ-120-12-L-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 20 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
SSQ-120-01-G-D

SSQ-120-01-G-D

CONN RCPT 40POS 0.1 GOLD PCB

Samtec Inc.

 456 9.05
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 SSQ-120-01-G-D

Datenblatt

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 40 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.335 (8.51mm) 0.104 (2.64mm) -55°C ~ 125°C UL94 V-0 Gold - -
CLP-121-02-L-D

CLP-121-02-L-D

CONN RCPT 42POS 0.05 GOLD SMD

Samtec Inc.

 163 9.25
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 CLP-121-02-L-D

Datenblatt

 Bulk CLP Active Receptacle Female Socket Board to Board 42 All 0.050 (1.27mm) 2 0.050 (1.27mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.090 (2.29mm) - -55°C ~ 125°C UL94 V-0 Tin - -
SL-118-T-10

SL-118-T-10

CONN RCPT .100 18POS GOLD PCB

Samtec Inc.

 3323 6.38
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 Bulk SL Active Receptacle Female Socket Board to Board 18 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.122 (3.10mm) 0.108 (2.75mm) -55°C ~ 125°C - - - -
SSQ-136-02-T-S

SSQ-136-02-T-S

CONN RCPT .100 36POS SNGL TIN

Samtec Inc.

 2163 6.38
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 SSQ-136-02-T-S

Datenblatt

 Bulk SSQ Active Receptacle Forked Board to Board or Cable 36 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.335 (8.51mm) 0.194 (4.93mm) -55°C ~ 105°C UL94 V-0 Tin - -
ESQ-104-12-G-T

ESQ-104-12-G-T

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

 2845 6.38
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Немедленный

 ESQ-104-12-G-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 12 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
HIF6A-20DA-1.27DS(71)

HIF6A-20DA-1.27DS(71)

CONN RCPT 20P 0.05 GOLD PCB R/A

Hirose Electric Co Ltd

 2019 6.38
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 HIF6A-20DA-1.27DS(71)

Datenblatt

 Tray HIF6 Active Receptacle Female Socket Board to Board or Cable 20 All 0.050 (1.27mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 8.00µin (0.203µm) Black 0.335 (8.51mm) 0.118 (3.00mm) -55°C ~ 85°C UL94 V-0 - - -
ESQ-104-12-S-T

ESQ-104-12-S-T

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

 3734 6.38
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Немедленный

 ESQ-104-12-S-T

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 12 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435 (11.05mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - -
HIF6B-20DA-1.27DS(71)

HIF6B-20DA-1.27DS(71)

CONN RCPT 20P 0.05 GOLD PCB R/A

Hirose Electric Co Ltd

 3840 6.38
- +

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Немедленный

 HIF6B-20DA-1.27DS(71)

Datenblatt

 Tray HIF6 Active Receptacle Female Socket Board to Board or Cable 20 All 0.050 (1.27mm) 2 0.100 (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 8.00µin (0.203µm) Black 0.335 (8.51mm) 0.118 (3.00mm) -55°C ~ 85°C UL94 V-0 - - -
ESQ-105-24-L-T

ESQ-105-24-L-T

CONN SOCKET 15POS 0.1 GOLD PCB

Samtec Inc.

 2138 6.38
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Немедленный

 ESQ-105-24-L-T

Datenblatt

 Bulk ESQ Active Elevated Socket Forked Board to Board 15 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535 (13.60mm) 0.380 (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - -
ESW-109-33-G-D

ESW-109-33-G-D

CONN SOCKET 18POS 0.1 GOLD PCB

Samtec Inc.

 3489 6.38
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Немедленный

 ESW-109-33-G-D

Datenblatt

 Tube ESW Active Elevated Socket Forked Board to Board 18 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-107-34-G-D-007

ESQ-107-34-G-D-007

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 3029 6.38
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Немедленный

 ESQ-107-34-G-D-007

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 14 13 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-107-34-G-D-013

ESQ-107-34-G-D-013

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 2679 6.38
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Немедленный

 ESQ-107-34-G-D-013

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 14 13 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.280 (7.11mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-107-39-G-D-014

ESQ-107-39-G-D-014

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 2309 6.38
- +

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Немедленный

 ESQ-107-39-G-D-014

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 14 13 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.480 (12.19mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-114-38-G-S

ESQ-114-38-G-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 3508 6.38
- +

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Немедленный

 ESQ-114-38-G-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435 (11.05mm) 0.290 (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-114-33-G-S

ESQ-114-33-G-S

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

 2613 6.38
- +

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Немедленный

 ESQ-114-33-G-S

Datenblatt

 Tube ESQ Active Elevated Socket Forked Board to Board 14 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
ESQ-113-33-G-S-LL

ESQ-113-33-G-S-LL

CONN SOCKET 13POS 0.1 GOLD PCB

Samtec Inc.

 2540 6.38
- +

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Немедленный

 ESQ-113-33-G-S-LL

Datenblatt

 Bulk ESQ Active Elevated Socket Forked Board to Board 13 All 0.100 (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635 (16.13mm) 0.090 (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - -
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