Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-06-19-F-S-482 CONN HDR 6POS 0.1 STACK T/H GOLD Samtec Inc.	2029	1.40	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	6	0.100 (2.54mm)	1	-	1.330 (33.782mm)	0.738 (18.745mm)	0.482 (12.243mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DWM-03-59-G-S-500 CONN HDR 3POS 0.05 STACK T/H Samtec Inc.	2744	1.40	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DWM	Active	3	0.050 (1.27mm)	1	-	0.755 (19.177mm)	0.135 (3.429mm)	0.500 (12.700mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
DWM-04-54-L-S-350 CONN HDR 4POS 0.05 STACK T/H Samtec Inc.	3634	1.40	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DWM	Active	4	0.050 (1.27mm)	1	-	0.555 (14.097mm)	0.085 (2.159mm)	0.350 (8.890mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	10.0µin (0.25µm)
HDWM-03-53-G-S-250-SM CONN HDR 3POS 0.05 STACK SMD Samtec Inc.	3939	1.40	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	3	0.050 (1.27mm)	1	-	0.485 (12.319mm)	0.235 (5.969mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
HDWM-03-53-G-S-265-SM CONN HDR 3POS 0.05 STACK SMD Samtec Inc.	2790	1.40	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	3	0.050 (1.27mm)	1	-	0.500 (12.700mm)	0.235 (5.969mm)	0.265 (6.731mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
HDWM-03-53-G-S-355-SM CONN HDR 3POS 0.05 STACK SMD Samtec Inc.	2134	1.40	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	3	0.050 (1.27mm)	1	-	0.590 (14.986mm)	0.235 (5.969mm)	0.355 (9.017mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
HW-02-10-G-D-350-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2301	1.40	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.765 (19.431mm)	0.415 (10.541mm)	0.350 (8.890mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
HW-03-09-S-S-433-120 CONN HDR 3POS 0.1 STACK T/H Samtec Inc.	3104	1.40	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	3	0.100 (2.54mm)	1	-	0.730 (18.542mm)	0.177 (4.496mm)	0.433 (11.000mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
HW-04-09-L-S-395-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2616	1.40	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	0.665 (16.891mm)	0.270 (6.858mm)	0.395 (10.033mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
HW-04-09-T-D-390-SM CONN HDR 8POS 0.1 STACK SMD TIN Samtec Inc.	3770	1.40	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.665 (16.891mm)	0.275 (6.985mm)	0.390 (9.906mm)	-	Surface Mount	Solder	Tin	-
HW-04-12-F-S-760-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2999	1.40	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	0.965 (24.511mm)	0.205 (5.207mm)	0.760 (19.304mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
JW-03-04-T-S-280-250 .156 FLEX STACK, POWER FLEXIBLE Samtec Inc.	3685	1.40	- + Добавить Немедленный		Bulk	JW	Active	3	0.156 (3.96mm)	1	-	0.620 (15.748mm)	0.250 (6.350mm)	0.280 (7.100mm)	0.090 (2.286mm)	Through Hole	Solder	Tin	-
TW-03-09-F-D-195-091 2.00 MM FLEX STACK, FLEXIBLE BOA Samtec Inc.	3429	1.40	- + Добавить Немедленный		Bulk	TW	Active	6	0.079 (2.00mm)	2	0.079 (2.00mm)	0.456 (11.582mm)	0.170 (4.318mm)	0.195 (4.953mm)	0.091 (2.311mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
59202-T28-05A065LF CONN HDR STACK SMD Amphenol ICC (FCI)	2091	1.40	- + Добавить Немедленный		Tape & Reel (TR)	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
98426-G13-07-237LF CONN HDR 14POS 0.079 STACK T/H Amphenol ICC (FCI)	2169	1.40	- + Добавить Немедленный	Datenblatt	Box	Minitek® 2.00mm	Active	14	0.079 (2.00mm)	2	0.079 (2.00mm)	1.024 (26.000mm)	0.157 (4.000mm)	0.768 (19.500mm)	0.091 (2.300mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
146505-5 CONN HDR 10POS 0.1 STACK T/H TE Connectivity AMP Connectors	2572	1.41	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.330 (33.782mm)	0.120 (3.050mm)	1.100 (27.940mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
59202-F34-08-111LF CONN HDR STACK SMD Amphenol ICC (FCI)	2350	1.41	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
146498-1 CONN HDR 2POS STACK T/H GOLD TE Connectivity AMP Connectors	2037	1.41	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	2	-	2	0.100 (2.54mm)	1.030 (26.162mm)	0.330 (8.382mm)	0.370 (9.400mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
54122-116142200LF CONN HDR 14POS 0.100 STACK T/H Amphenol ICC (FCI)	3136	1.41	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	1.425 (36.200mm)	0.439 (11.151mm)	0.866 (22.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
5-146465-8 CONN HDR 8POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3568	1.41	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	8	0.100 (2.54mm)	1	-	0.930 (23.622mm)	0.120 (3.050mm)	0.700 (17.780mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)