Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
5-146455-8 CONN HDR 8POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3603	1.37	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	8	0.100 (2.54mm)	1	-	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
54122-412202500LF CONN HDR 20POS 0.100 STACK TH Amphenol ICC (FCI)	3735	1.37	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	20	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.221 (5.613mm)	0.984 (25.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
20021813-09016T1LF CONN HDR 16POS 0.050 STACK TH Amphenol ICC (FCI)	3868	1.37	- + Добавить Немедленный		Tube	20021813	Active	16	0.050 (1.27mm)	2	0.050 (1.27mm)	0.551 (14.000mm)	0.098 (2.500mm)	0.354 (9.000mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	Flash
59132-T40-09-150LF CONN HDR 18POS 0.079 STACK TH Amphenol ICC (FCI)	2135	1.37	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	18	0.079 (2.00mm)	2	0.079 (2.00mm)	0.831 (21.100mm)	0.122 (3.100mm)	0.591 (15.000mm)	0.118 (3.000mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
59202-F38-05-125LF CONN HDR STACK SMD Amphenol ICC (FCI)	3071	1.37	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54122-119201300LF CONN HDR 20POS 0.100 STACK T/H Amphenol ICC (FCI)	2951	1.38	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	20	0.100 (2.54mm)	2	0.100 (2.54mm)	0.882 (22.400mm)	0.250 (6.350mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-119201550LF CONN HDR 20POS 0.100 STACK T/H Amphenol ICC (FCI)	3543	1.38	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	20	0.100 (2.54mm)	2	0.100 (2.54mm)	0.882 (22.400mm)	0.152 (3.850mm)	0.610 (15.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59132-T28-08-037LF CONN HDR STACK Amphenol ICC (FCI)	2859	1.38	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
59112-F36-04-094LF CONN HDR STACK Amphenol ICC (FCI)	3666	1.38	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54121-118182250LF CONN HDR 18POS 0.100 STACK T/H Amphenol ICC (FCI)	3753	1.38	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	18	0.100 (2.54mm)	1	-	1.102 (28.000mm)	0.096 (2.450mm)	0.886 (22.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-809161550LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	3766	1.38	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.294 (7.468mm)	0.610 (15.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
HPW-02-04-T-S-590-090 .200 POWER BOARD STACKER Samtec Inc.	3572	1.29	- + Добавить Немедленный		Bulk	HPW	Active	2	0.200 (5.08mm)	1	-	0.770 (19.558mm)	0.090 (2.286mm)	0.590 (14.986mm)	0.090 (2.286mm)	Through Hole	Solder	Tin	-
54122-108161200LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	2562	1.38	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.333 (8.450mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
5-146505-5 CONN HDR 10POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2094	1.38	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.330 (33.782mm)	0.120 (3.050mm)	1.100 (27.940mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
54122-109161150LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	2784	1.38	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.453 (11.500mm)	0.453 (11.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-109161700LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	3637	1.38	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.236 (6.000mm)	0.669 (17.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-809161400LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	3834	1.38	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.354 (9.000mm)	0.551 (14.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-109160800LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	2260	1.38	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.615 (15.621mm)	0.315 (8.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-109160800LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	3799	1.38	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.590 (14.986mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-109161850LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	2214	1.38	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.176 (4.470mm)	0.728 (18.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)