Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-03-17-H-S-265 CONN HDR 3POS 0.1 STACK T/H GOLD Samtec Inc.	2482	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	3	0.100 (2.54mm)	1	-	0.480 (12.192mm)	0.105 (2.667mm)	0.265 (6.731mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
DW-05-10-F-S-625-LL CONN HDR 5POS 0.1 STACK T/H GOLD Samtec Inc.	3612	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	5	0.100 (2.54mm)	1	-	0.830 (21.082mm)	0.095 (2.413mm)	0.625 (15.875mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-08-10-T-S-530 CONN HDR 8POS 0.1 STACK T/H TIN Samtec Inc.	2614	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	8	0.100 (2.54mm)	1	-	0.830 (21.082mm)	0.190 (4.826mm)	0.530 (13.462mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
DW-09-15-TM-S-400 CONN HDR 9POS 0.1 STACK T/H TIN Samtec Inc.	2234	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	9	0.100 (2.54mm)	1	-	0.630 (16.002mm)	0.120 (3.048mm)	0.400 (10.160mm)	0.110 (2.794mm)	Through Hole	Solder	Tin	-
HW-02-10-L-D-350-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3328	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.765 (19.431mm)	0.415 (10.541mm)	0.350 (8.890mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
HW-03-09-F-D-260-135 CONN HDR 6POS 0.1 STACK T/H Samtec Inc.	3938	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.730 (18.542mm)	0.335 (8.509mm)	0.260 (6.604mm)	0.135 (3.429mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-03-09-F-D-400-130 CONN HDR 6POS 0.1 STACK T/H Samtec Inc.	3706	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.730 (18.542mm)	0.200 (5.080mm)	0.400 (10.160mm)	0.130 (3.302mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-04-15-F-S-295-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2718	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	0.565 (14.351mm)	0.270 (6.858mm)	0.295 (7.493mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-04-15-F-S-300-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2470	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	0.565 (14.351mm)	0.265 (6.731mm)	0.300 (7.620mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-04-15-F-S-350-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2196	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	0.565 (14.351mm)	0.215 (5.461mm)	0.350 (8.890mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-15-T-S-350-SM-A CONN HDR 2POS 0.1 STACK SMD TIN Samtec Inc.	3570	1.16	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	2	0.100 (2.54mm)	1	-	0.565 (14.351mm)	0.215 (5.461mm)	0.350 (8.890mm)	-	Surface Mount	Solder	Tin	-
59202-T24-02-066LF CONN HDR STACK SMD Amphenol ICC (FCI)	3261	1.16	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
5-146505-4 CONN HDR 8POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	3594	1.16	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.330 (33.782mm)	0.120 (3.050mm)	1.100 (27.940mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
146505-4 CONN HDR 8POS 0.1 STACK T/H TE Connectivity AMP Connectors	2190	1.16	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.330 (33.782mm)	0.120 (3.050mm)	1.100 (27.940mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
5-146460-7 CONN HDR 7POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2165	1.16	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	7	0.100 (2.54mm)	1	-	0.617 (15.672mm)	0.057 (1.448mm)	0.450 (11.430mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
146460-7 CONN HDR 7POS 0.1 STACK T/H TE Connectivity AMP Connectors	2258	1.16	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	7	0.100 (2.54mm)	1	-	0.617 (15.672mm)	0.057 (1.448mm)	0.450 (11.430mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
75970-115-08LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2795	1.16	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.293 (7.450mm)	0.374 (9.500mm)	0.157 (4.000mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54112-807181500LF CONN HDR 18POS 0.100 STACK T/H Amphenol ICC (FCI)	3201	1.16	- + Добавить Немедленный		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	18	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.140 (3.556mm)	0.591 (15.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-105161000LF CONN HDR 16POS 0.100 STACK T/H Amphenol ICC (FCI)	3620	1.17	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	2	0.100 (2.54mm)	0.695 (17.650mm)	0.181 (4.600mm)	0.394 (10.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59202-F34-05-114LF CONN HDR STACK SMD Amphenol ICC (FCI)	2496	1.17	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-