Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-07-16-F-S-200 CONN HDR 7POS 0.1 STACK T/H GOLD Samtec Inc.	3644	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	7	0.100 (2.54mm)	1	-	0.445 (11.303mm)	0.135 (3.429mm)	0.200 (5.080mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HDWM-02-59-G-S-535-SM CONN HDR 2POS 0.05 STACK SMD Samtec Inc.	3125	1.13	- + Добавить Немедленный		Bulk	Flex Stack, HDWM	Active	2	0.050 (1.27mm)	1	-	1.000 (25.400mm)	0.465 (11.811mm)	0.535 (13.589mm)	-	Surface Mount	Solder	Gold	10.0µin (0.25µm)
EW-03-10-F-D-350 CONN HDR 6POS 0.1 STACK T/H GOLD Samtec Inc.	2693	1.13	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.830 (21.082mm)	0.150 (3.810mm)	0.350 (8.890mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-05-13-F-S-671 CONN HDR 5POS 0.1 STACK T/H GOLD Samtec Inc.	2090	1.13	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	5	0.100 (2.54mm)	1	-	1.230 (31.242mm)	0.229 (5.817mm)	0.671 (17.043mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
EW-06-10-F-S-300 CONN HDR 6POS 0.1 STACK T/H GOLD Samtec Inc.	2370	1.13	- + Добавить Немедленный		Bulk	Flex Stack, EW	Active	6	0.100 (2.54mm)	1	-	0.830 (21.082mm)	0.200 (5.080mm)	0.300 (7.620mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-03-10-T-D-250-SM CONN HDR 6POS 0.1 STACK SMD TIN Samtec Inc.	3579	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.765 (19.431mm)	0.515 (13.081mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Tin	-
HW-03-10-T-D-475-SM CONN HDR 6POS 0.1 STACK SMD TIN Samtec Inc.	2785	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.765 (19.431mm)	0.290 (7.366mm)	0.475 (12.065mm)	-	Surface Mount	Solder	Tin	-
HW-03-13-T-S-1000-115-002 CONN HDR 3POS 0.1 STACK T/H Samtec Inc.	3190	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	3	0.100 (2.54mm)	1	-	1.230 (31.242mm)	0.115 (2.921mm)	1.000 (25.400mm)	0.115 (2.921mm)	Through Hole	Solder	Tin	-
HW-04-17-F-S-250-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3595	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	0.415 (10.541mm)	0.165 (4.191mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-04-20-T-S-350-SM CONN HDR 4POS 0.1 STACK SMD TIN Samtec Inc.	2405	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	1.065 (27.051mm)	0.715 (18.161mm)	0.350 (8.890mm)	-	Surface Mount	Solder	Tin	-
HW-05-08-F-S-200-117 CONN HDR 5POS 0.1 STACK T/H Samtec Inc.	3241	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	5	0.100 (2.54mm)	1	-	0.530 (13.462mm)	0.213 (5.410mm)	0.200 (5.080mm)	0.117 (2.972mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-05-08-F-S-300-100 CONN HDR 5POS 0.1 STACK T/H Samtec Inc.	2987	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	5	0.100 (2.54mm)	1	-	0.530 (13.462mm)	0.130 (3.302mm)	0.300 (7.620mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-02-20-F-D-822-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3213	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.065 (27.051mm)	0.243 (6.172mm)	0.822 (20.879mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-20-F-D-825-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3104	1.13	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.065 (27.051mm)	0.240 (6.096mm)	0.825 (20.955mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
ZW-06-10-F-S-590-120 .100 FLEX STACK, FLEXIBLE BOARD Samtec Inc.	3883	1.13	- + Добавить Немедленный		Bulk	Flex Stack, ZW	Active	6	0.100 (2.54mm)	1	-	0.830 (21.082mm)	0.120 (3.048mm)	0.590 (14.986mm)	0.120 (3.048mm)	Through Hole	Solder	Gold	Flash
54121-418182250LF CONN HDR 18POS 0.100 STACK TH Amphenol ICC (FCI)	2102	1.13	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	18	0.100 (2.54mm)	1	-	1.102 (28.000mm)	0.096 (2.450mm)	0.886 (22.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-406180800LF CONN HDR 18POS 0.100 STACK TH Amphenol ICC (FCI)	2860	1.13	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	18	0.100 (2.54mm)	2	0.100 (2.54mm)	0.745 (18.923mm)	0.309 (7.849mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
59112-T28-10-050LF CONN HDR 20POS 0.079 STACK TH Amphenol ICC (FCI)	3995	1.13	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	20	0.079 (2.00mm)	2	0.079 (2.00mm)	0.465 (11.800mm)	0.169 (4.300mm)	0.197 (5.000mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
146501-2 CONN HDR 4POS 0.1 STACK T/H GOLD TE Connectivity AMP Connectors	3394	1.14	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.130 (28.700mm)	0.330 (8.382mm)	0.470 (11.938mm)	0.330 (8.382mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
54122-108141200LF CONN HDR 14POS 0.100 STACK T/H Amphenol ICC (FCI)	2983	1.14	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	14	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.333 (8.450mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)