Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
HW-02-16-F-D-265-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3245	0.85	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.380 (9.650mm)	0.115 (2.921mm)	0.265 (6.731mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-16-F-D-290-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	3606	0.85	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.380 (9.650mm)	0.090 (2.286mm)	0.290 (7.366mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-17-F-D-250-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2296	0.85	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.415 (10.541mm)	0.165 (4.191mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-17-F-D-325-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2661	0.85	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.415 (10.541mm)	0.090 (2.286mm)	0.325 (8.255mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-02-17-F-D-330-SM CONN HDR 4POS 0.1 STACK SMD GOLD Samtec Inc.	2419	0.85	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.415 (10.541mm)	0.085 (2.159mm)	0.330 (8.382mm)	-	Surface Mount	Solder	Gold	3.00µin (0.076µm)
HW-04-17-T-S-250-SM CONN HDR 4POS 0.1 STACK SMD TIN Samtec Inc.	2111	0.85	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	4	0.100 (2.54mm)	1	-	0.415 (10.541mm)	0.165 (4.191mm)	0.250 (6.350mm)	-	Surface Mount	Solder	Tin	-
TW-03-03-F-S-140-100 2.00 MM FLEX STACK, FLEXIBLE BOA Samtec Inc.	3297	0.85	- + Добавить Немедленный		Bulk	TW	Active	3	0.079 (2.00mm)	1	-	0.535 (13.589mm)	0.295 (7.493mm)	0.140 (3.556mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
146505-3 CONN HDR 6POS 0.1 STACK T/H TE Connectivity AMP Connectors	2153	0.85	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	1.330 (33.782mm)	0.120 (3.050mm)	1.100 (27.940mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
5-146505-3 CONN HDR 6POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2873	0.85	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	1.330 (33.782mm)	0.120 (3.050mm)	1.100 (27.940mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
5-146503-2 CONN HDR 4POS 0.1 STACK T/H GOLD TE Connectivity AMP Connectors	3905	0.85	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.230 (31.242mm)	0.330 (8.382mm)	0.800 (20.320mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
146503-2 CONN HDR 4POS 0.1 STACK T/H GOLD TE Connectivity AMP Connectors	2906	0.85	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.230 (31.242mm)	0.330 (8.382mm)	0.800 (20.320mm)	0.100 (2.540mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
59202-T28-05-060LF CONN HDR 10P 0.079 STACK SMD Amphenol ICC (FCI)	2816	0.85	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	10	0.079 (2.00mm)	2	0.079 (2.00mm)	0.398 (10.100mm)	0.161 (4.100mm)	0.236 (6.000mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
59112-R30-05-051LF CONN HDR 10POS 0.079 STACK T/H Amphenol ICC (FCI)	3360	0.85	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	10	0.079 (2.00mm)	2	0.079 (2.00mm)	0.531 (13.500mm)	0.232 (5.900mm)	0.201 (5.100mm)	0.098 (2.500mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
59112-T40-04-150LF CONN HDR 8POS 0.079 STACK T/H Amphenol ICC (FCI)	2355	0.85	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	8	0.079 (2.00mm)	2	0.079 (2.00mm)	0.831 (21.100mm)	0.142 (3.600mm)	0.591 (15.000mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
10066848-108LF CONN HDR 8POS 0.079 STACK T/H Amphenol ICC (FCI)	3692	0.85	- + Добавить Немедленный	Datenblatt	Tape & Reel (TR)	Minitek®	Active	8	0.079 (2.00mm)	2	0.079 (2.00mm)	0.791 (20.091mm)	0.134 (3.400mm)	0.559 (14.200mm)	0.098 (2.500mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-116082000LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3397	0.86	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.425 (36.200mm)	0.518 (13.157mm)	0.787 (20.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
76745-8DH-08LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3909	0.86	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.827 (21.000mm)	0.256 (6.500mm)	0.315 (8.000mm)	0.256 (6.500mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54111-404161200LF CONN HDR 16POS 0.100 STACK TH Amphenol ICC (FCI)	3353	0.86	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	16	0.100 (2.54mm)	1	-	0.660 (16.764mm)	0.093 (2.362mm)	0.472 (12.000mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
59132-F34-03-075LF CONN HDR STACK Amphenol ICC (FCI)	3039	0.86	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
59132-F34-03-075 CONN HDR STACK Amphenol ICC (FCI)	3134	0.86	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-