Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54111-802020850LF CONN HDR STACK Amphenol ICC (FCI)	3865	0.36	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
75970-8AP-02LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	3014	0.36	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	1.750 (44.450mm)	0.135 (3.429mm)	1.480 (37.600mm)	0.135 (3.429mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
5-146459-1 CONN HDR 1POS STACK T/H TIN TE Connectivity AMP Connectors	3475	0.37	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	0.617 (15.672mm)	0.107 (2.718mm)	0.400 (10.160mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
5-146465-1 CONN HDR 1POS STACK T/H TIN TE Connectivity AMP Connectors	2334	0.37	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	0.930 (23.622mm)	0.120 (3.050mm)	0.700 (17.780mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
146459-1 CONN HDR 1POS STACK T/H TIN-LEAD TE Connectivity AMP Connectors	3245	0.37	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	0.617 (15.672mm)	0.107 (2.718mm)	0.400 (10.160mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
146465-1 CONN HDR 1POS STACK T/H TIN-LEAD TE Connectivity AMP Connectors	3221	0.37	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	0.930 (23.622mm)	0.120 (3.050mm)	0.700 (17.780mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
54121-112041300LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2372	0.37	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.325 (33.660mm)	0.693 (17.600mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-808031450LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2196	0.38	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.234 (5.944mm)	0.571 (14.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
59132-F34-03-060LF CONN HDR 6POS 0.079 STACK T/H Amphenol ICC (FCI)	3862	0.38	- + Добавить Немедленный	Datenblatt	Bag	Minitek® 2.00mm	Active	6	0.079 (2.00mm)	2	0.079 (2.00mm)	0.614 (15.600mm)	0.260 (6.600mm)	0.236 (6.000mm)	0.118 (3.000mm)	Through Hole	Solder	Gold	8.00µin (0.203µm)
54122-107041200LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2725	0.38	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.232 (5.900mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-411041700LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2039	0.38	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.225 (31.115mm)	0.436 (11.074mm)	0.669 (17.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-807040800LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2021	0.38	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.390 (9.900mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-107041150LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3988	0.38	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.252 (6.400mm)	0.453 (11.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59112-S26-02-040LF CONN HDR 4POS 0.079 STACK T/H Amphenol ICC (FCI)	3875	0.38	- + Добавить Немедленный	Datenblatt	Bulk	Minitek® 2.00mm	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.402 (10.200mm)	0.146 (3.700mm)	0.157 (4.000mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
5-146505-1 CONN HDR 2POS STACK T/H TIN TE Connectivity AMP Connectors	3410	0.39	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	2	-	2	0.100 (2.54mm)	1.330 (33.782mm)	0.120 (3.050mm)	1.100 (27.940mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
69057-006LF CONN HDR 4POS 0.079 STACK SMD Amphenol ICC (FCI)	3427	0.39	- + Добавить Немедленный		Bag	Minitek® MezzSelect™, Basics+	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.343 (8.712mm)	0.146 (3.700mm)	0.197 (5.000mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
5-146461-1 CONN HDR 1POS STACK T/H TIN TE Connectivity AMP Connectors	2904	0.39	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	0.739 (18.771mm)	0.129 (3.277mm)	0.500 (12.700mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
146461-1 CONN HDR 1POS STACK T/H TIN-LEAD TE Connectivity AMP Connectors	2238	0.39	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	1	-	1	-	0.739 (18.771mm)	0.129 (3.277mm)	0.500 (12.700mm)	0.110 (2.800mm)	Through Hole	Solder	Tin-Lead	100.0µin (2.54µm)
5-146455-2 CONN HDR 2POS 0.1 STACK T/H TIN TE Connectivity AMP Connectors	2477	0.39	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	2	0.100 (2.54mm)	1	-	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
DW-01-07-F-D-200 CONN HDR 2POS STACK T/H GOLD Samtec Inc.	3672	0.39	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	2	-	2	0.100 (2.54mm)	0.430 (10.922mm)	0.120 (3.048mm)	0.200 (5.080mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)