Rectangular Connectors - Board Spacers, Stackers (Board to Board) - Element(Гонконг) Technology Co., Ltd.

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Производитель. Часть #	Акции	Цены	А	Таблицы данных	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
DW-01-12-F-S-700 CONN HDR 1POS STACK T/H GOLD Samtec Inc.	3398	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	1	-	1	-	1.030 (26.162mm)	0.220 (5.588mm)	0.700 (17.780mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-01-12-F-S-750 CONN HDR 1POS STACK T/H GOLD Samtec Inc.	2280	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	1	-	1	-	1.030 (26.162mm)	0.170 (4.318mm)	0.750 (19.050mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-01-12-F-S-787 CONN HDR 1POS STACK T/H GOLD Samtec Inc.	3206	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	1	-	1	-	1.030 (26.162mm)	0.133 (3.378mm)	0.787 (20.000mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-01-14-F-S-1200 CONN HDR 1POS STACK T/H GOLD Samtec Inc.	3189	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	1	-	1	-	1.430 (36.322mm)	0.120 (3.048mm)	1.200 (30.480mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
DW-01-14-F-S-750 CONN HDR 1POS STACK T/H GOLD Samtec Inc.	2330	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, DW	Active	1	-	1	-	1.430 (36.322mm)	0.570 (14.478mm)	0.750 (19.050mm)	0.110 (2.794mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-01-07-F-S-200-110 CONN HDR 1POS STACK T/H Samtec Inc.	2082	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	1	-	1	-	0.430 (10.922mm)	0.120 (3.048mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-01-07-F-S-200-117 CONN HDR 1POS STACK T/H Samtec Inc.	3419	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	1	-	1	-	0.430 (10.922mm)	0.113 (2.870mm)	0.200 (5.080mm)	0.117 (2.972mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-01-08-F-S-200-117 CONN HDR 1POS STACK T/H Samtec Inc.	2850	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	1	-	1	-	0.530 (13.462mm)	0.213 (5.410mm)	0.200 (5.080mm)	0.117 (2.972mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
HW-01-08-F-S-295-117 CONN HDR 1POS STACK T/H Samtec Inc.	3993	0.27	- + Добавить Немедленный	Datenblatt	Bulk	Flex Stack, HW	Active	1	-	1	-	0.530 (13.462mm)	0.118 (2.997mm)	0.295 (7.493mm)	0.117 (2.972mm)	Through Hole	Solder	Gold	3.00µin (0.076µm)
861400061YD1787LF CONN HDR 6POS 0.100 STACK T/H Amphenol ICC (FCI)	3414	0.27	- + Добавить Немедленный		Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	-	-	-	-	Through Hole	Kinked Pin, Solder	Gold	-
5-146483-1 CONN HDR 2POS STACK T/H TIN TE Connectivity AMP Connectors	3093	0.27	- + Добавить Немедленный	Datenblatt	Bulk	AMPMODU Mod II	Active	2	-	2	0.100 (2.54mm)	0.440 (11.176mm)	0.130 (3.300mm)	0.200 (5.080mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	100.0µin (2.54µm)
54121-109031550LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3222	0.27	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.294 (7.468mm)	0.610 (15.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-407081550LF CONN HDR STACK Amphenol ICC (FCI)	2830	0.27	- + Добавить Немедленный		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54121-421042600LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2486	0.27	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.266 (32.150mm)	0.122 (3.100mm)	1.024 (26.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-393R03LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3938	0.28	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.515 (13.081mm)	0.130 (3.300mm)	0.256 (6.500mm)	0.130 (3.300mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-404020700LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2234	0.28	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.660 (16.764mm)	0.264 (6.700mm)	0.276 (7.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54111-803020800LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	3353	0.28	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.217 (5.500mm)	0.315 (8.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54111-406041500LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2065	0.29	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.744 (18.900mm)	0.059 (1.500mm)	0.591 (15.000mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54112-107041100LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2267	0.29	- + Добавить Немедленный	Datenblatt	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.297 (7.544mm)	0.433 (11.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-119041300LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3141	0.29	- + Добавить Немедленный	Datenblatt	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.882 (22.400mm)	0.250 (6.350mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)