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Фотографии Производитель. Часть # Акции Цены А Таблицы данных Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSE06-503045

HSE06-503045

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

1197 2.35
- +

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Немедленный

HSE06-503045

Datenblatt

Bag HSE Active Board Level Clip Rectangular, Fins 1.969 (50.00mm) 1.181 (30.00mm) - 1.772 (45.00mm) 12.79W @ 75°C 2.10°C/W @ 200 LFM 5.86°C/W Aluminum Alloy
NTE498

NTE498

HEATSINK FOR PLASTIC PWR

NTE Electronics, Inc

532 2.42
- +

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Немедленный

NTE498

Datenblatt

Bag - Active Top Mount Bolt On Rectangular, Fins 1.500 (38.10mm) 0.500 (12.70mm) - 1.375 (34.93mm) - - 10.40°C/W Aluminum Alloy
HSE08-505028

HSE08-505028

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

1118 2.46
- +

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Немедленный

HSE08-505028

Datenblatt

Bag HSE Active Board Level Clip Rectangular, Angled Fins 1.969 (50.00mm) 1.102 (28.00mm) - 1.969 (50.00mm) 10.53W @ 75°C 2.70°C/W @ 200 LFM 7.13°C/W Aluminum Alloy
V2276E1

V2276E1

CPU HEATSINK, CROSS CUT, AL6063

Assmann WSW Components

1499 1499.00
- +

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Немедленный

V2276E1

Datenblatt

Bulk - Active - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.984 (25.00mm) - - 19.50°C/W
HSB27-434316

HSB27-434316

HEAT SINK, BGA, 43.1 X 43.1 X 16

CUI Devices

1081 2.60
- +

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Немедленный

HSB27-434316

Datenblatt

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.697 (43.10mm) 1.697 (43.10mm) - 0.650 (16.51mm) 8.98W @ 75°C 2.80°C/W @ 200 LFM 8.35°C/W Aluminum Alloy
ATS-PCB1056

ATS-PCB1056

HEATSINK TO-218/TO-247 ALUMINUM

Advanced Thermal Solutions Inc.

379 2.72
- +

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Немедленный

ATS-PCB1056

Datenblatt

Bulk - Active Board Level, Vertical Bolt On and Board Mounts Rectangular, Fins 1.622 (41.20mm) 2.010 (51.00mm) - 0.748 (19.00mm) - 2.40°C/W @ 200 LFM 8.00°C/W Aluminum
HSE02-173213P

HSE02-173213P

HEAT SINK, EXTRUSION, 17 X 31.9

CUI Devices

1572 2.86
- +

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HSE02-173213P

Datenblatt

Box HSE Active Top Mount Thermal Tape, Adhesive (Included) Square, Angled Fins 0.669 (17.00mm) 0.669 (17.00mm) - 0.492 (12.50mm) 3.5W @ 75°C 6.70°C/W @ 200 LFM 21.44°C/W Aluminum Alloy
TGH-0510-01

TGH-0510-01

ALUMINIUM HEAT SINK 51X35MM

t-Global Technology

204 2.86
- +

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Немедленный

TGH-0510-01

Datenblatt

Bulk - Active Top Mount - Rectangular, Fins 1.378 (35.00mm) 2.008 (51.00mm) - 0.197 (5.00mm) - - - Aluminum
TGH-0280-07

TGH-0280-07

ALUMINIUM HEAT SINK 28X28MM

t-Global Technology

158 2.86
- +

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Немедленный

TGH-0280-07

Datenblatt

Bulk - Active Top Mount - Square, Fins 1.102 (28.00mm) 1.102 (28.00mm) - 0.591 (15.01mm) - - - Aluminum
NTE448B

NTE448B

CLIP-ON H/S FOR 14/16 DIP

NTE Electronics, Inc

270 2.90
- +

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Немедленный

NTE448B

Datenblatt

Bag - Active Top Mount Press Fit Rectangular, Angled Fins 0.887 (22.53mm) 0.600 (15.24mm) - 0.410 (10.42mm) - - 20.00°C/W Aluminum Alloy
RPIHS-01

RPIHS-01

RASPBERRY PI LOW PROF HEAT SINK

OSEPP Electronics LTD

605 2.95
- +

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Немедленный

RPIHS-01

Datenblatt

Retail Package - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins - - - - - - - Aluminum
XL25D-TO247-22-17-0.64

XL25D-TO247-22-17-0.64

CERAMIC HEAT SPREADER 22X17X0.63

t-Global Technology

121 2.96
- +

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Немедленный

XL25D-TO247-22-17-0.64

Datenblatt

Bulk XL-25 Active Heat Spreader - Rectangular 0.866 (22.00mm) 0.669 (17.00mm) - 0.025 (0.64mm) - - - Ceramic
XL25D-TO220-20-14-0.64

XL25D-TO220-20-14-0.64

CERAMIC HEAT SPREADER 20X14X0.63

t-Global Technology

107 2.96
- +

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XL25D-TO220-20-14-0.64

Datenblatt

Bulk XL-25 Active Heat Spreader - Rectangular 0.787 (20.00mm) 0.551 (14.00mm) - 0.025 (0.64mm) - - - Ceramic
ATS-PCB1037

ATS-PCB1037

HEATSINK TO-220 W/TAB BLACK

Advanced Thermal Solutions Inc.

1486 3.19
- +

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Немедленный

ATS-PCB1037

Datenblatt

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.380 (35.05mm) 1.000 (25.40mm) - 0.500 (12.70mm) - 13.00°C/W @ 200 LFM 18.00°C/W Aluminum
TGH-0350-03

TGH-0350-03

ALUMINIUM HEAT SINK 35X35MM

t-Global Technology

107 3.24
- +

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Немедленный

TGH-0350-03

Datenblatt

Bulk - Active Top Mount - Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.591 (15.01mm) - - - Aluminum
HSE07-753045

HSE07-753045

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

993 3.40
- +

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Немедленный

HSE07-753045

Datenblatt

Bag HSE Active Board Level Clip Rectangular, Fins 2.953 (75.00mm) 1.181 (30.00mm) - 1.772 (45.00mm) 15.46W @ 75°C 2.10°C/W @ 200 LFM 4.85°C/W Aluminum Alloy
TGH-0260-02

TGH-0260-02

ALUMINIUM HEAT SINK 26X26MM

t-Global Technology

1000 3.43
- +

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Немедленный

TGH-0260-02

Datenblatt

Bulk - Active Top Mount - Square, Pin Fins 1.024 (26.00mm) 1.024 (26.00mm) - 0.583 (14.80mm) - - - Aluminum
TGH-0300-03

TGH-0300-03

ALUMINIUM HEAT SINK 30X30MM

t-Global Technology

183 3.43
- +

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Немедленный

TGH-0300-03

Datenblatt

Bulk - Active Top Mount - Square, Pin Fins 1.181 (30.00mm) 1.181 (30.00mm) - 0.472 (12.00mm) - - - Aluminum
HSE09-755028

HSE09-755028

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

999 3.45
- +

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Немедленный

HSE09-755028

Datenblatt

Bag HSE Active Board Level Clip Rectangular, Angled Fins 2.953 (75.00mm) 1.102 (28.00mm) - 1.969 (50.00mm) 13.26W @ 75°C 2.50°C/W @ 200 LFM 5.66°C/W Aluminum Alloy
V2271E1

V2271E1

CPU HEATSINK, CROSS CUT, AL6063

Assmann WSW Components

1449 1449.00
- +

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Немедленный

V2271E1

Datenblatt

Bulk - Active - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 1.177 (29.90mm) - - 12.00°C/W
Total 113324 Records«Prev1... 4647484950515253...5667Next»
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