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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TS391AX500CTHERMALLY STABLE SOLDER PASTE NO |
3883 | 97.50 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD2SWLF.031 .7OZLF SOLDER WIRE POCKET PACK 99.3/ |
3500 | 8.99 |
ДобавитьНемедленный |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Lead Free | Tube, 0.7 oz (19.85g) | - | - |
|
RASW.031 4OZSOLDER WIRE 63/37 TIN/LEAD ROSIN |
3794 | 9.41 |
ДобавитьНемедленный |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
SMDSWLF.031 .7OZLF SOLDER WIRE POCKET PACK 96.5/ |
3169 | 9.99 |
ДобавитьНемедленный |
Datenblatt |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Lead Free | Tube, 0.7 oz (19.85g) | - | - |
|
SMD2SW.031 2OZSOLDER WIRE 60/40 TIN/LEAD NO-CL |
3247 | 10.08 |
ДобавитьНемедленный |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SMD2SW.020 2OZSOLDER WIRE 60/40 TIN/LEAD NO-CL |
2829 | 10.41 |
ДобавитьНемедленный |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SSWS-T5-50GSOLDER PASTE WATER SOLUBLE 63/37 |
2433 | 31.99 |
ДобавитьНемедленный |
Datenblatt |
Bag | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | - | Rosin Mildly Activated (RMA), Water Soluble | - | 5 | - | Jar, 1.76 oz (50g) | 24 Months | Date of Manufacture |
|
SMD4300SNL10T4SLDR PST WATR SOL SAC305 T4 10CC |
3623 | 32.95 |
ДобавитьНемедленный |
Datenblatt |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2SWLT.040 20GSN42/BI57.6/AG0.4 2.2% FLUX CORE |
2817 | 34.15 |
ДобавитьНемедленный |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.7 oz (20g) | - | - |
|
4900P-25GLEAD FREE NO CLEAN SOLDER PASTE |
2871 | 35.56 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 4900 | Active | Solder Paste | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | - | 423 ~ 430°F (217 ~ 221°C) | No-Clean | - | - | Lead Free | Syringe, 0.88 oz (25g) | 24 Months | Date of Manufacture |
|
NC191SNL50T5SMOOTH FLOW LEAD-FREE SOLDER PAS |
3561 | 35.95 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
SSNC-T5-50G63/37 SOLDER PASTE T5 - 50 GRAM |
3214 | 26.99 |
ДобавитьНемедленный |
Datenblatt |
Bag | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SSLTNC-T5-35GLOW TEMPERATURE LEAD FREE SOLDER |
3620 | 26.99 |
ДобавитьНемедленный |
Datenblatt |
Bag | - | Active | Solder Paste | Sn42Bi57Ag1 (42/57/1) | - | 279°F (137°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SSWS-35GSOLDER PASTE WATER SOLUBLE 63/37 |
3191 | 20.99 |
ДобавитьНемедленный |
Datenblatt |
Bag | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | - | Water Soluble | - | 3 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
NC191LTA50T5SMOOTH FLOW LOW TEMP SOLDER PAST |
2458 | 27.95 |
ДобавитьНемедленный |
Datenblatt |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
1354225LOCTITE WS 300 97SCT3V 75G SYRIN |
3429 | 29.05 |
ДобавитьНемедленный |
Bulk | WS300 | Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Syringe, 2.65 oz (75g) | 6 Months | Date of Manufacture | |
|
WBNCSAC20LEAD FREE NO-CLEAN FLUX CORE SIL |
2460 | 97.99 |
ДобавитьНемедленный |
Datenblatt |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD4300SNL250T5SOLDER PASTE SAC305 250G T5 |
3773 | 103.95 |
ДобавитьНемедленный |
Datenblatt |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
TS991SNL500T3SOLDER PASTE THERMALLY STABLE NC |
3255 | 107.19 |
ДобавитьНемедленный |
Datenblatt |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
24-7068-7609SOLDER FLUX-CORED/275 .015 1LB |
195 | 151.11 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 275 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
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