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| Фотографии | Производитель. Часть # | Акции | Цены | А | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2069189-1CONN SOCKET LGA 1944POS GOLD |
2331 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tray | - | Obsolete | LGA | 1944 (G34) | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) |
|
|
2069189-2CONN SOCKET LGA 1944POS GOLD |
3472 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tray | - | Obsolete | LGA | 1944 (G34) | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039 (1.00mm) | - | - | - | Liquid Crystal Polymer (LCP) |
|
2-382189-2CONN IC DIP SOCKET 32POS GOLD |
2366 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Thermoplastic |
|
2-382468-4CONN IC DIP SOCKET 40POS GOLD |
3412 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | Thermoplastic |
|
2-641262-4CONN IC DIP SOCKET 16POS GOLD |
3963 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641599-4CONN IC DIP SOCKET 14POS GOLD |
3579 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-641604-4CONN IC DIP SOCKET 24POS GOLD |
2007 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-641610-4CONN IC DIP SOCKET 16POS GOLD |
3300 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | - |
|
345725-5CONN IC DIP SOCKET 22POS TINLEAD |
2475 | 0.00 |
ДобавитьНемедленный |
Tube | - | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | - | - | |
|
528-AG11D-ESCONN IC DIP SOCKET 28POS GOLD |
2478 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
1-1437504-6CONN TRANSIST TO-5 3POS GOLD |
2963 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
- | 8060 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | - | - | - | Solder | - | - | - | - | - |
|
8059-2G2CONN TRANSIST TO-5 3POS GOLD |
3508 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Bulk | 8059 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon |
|
|
8060-1G34CONN TRANSIST TO-5 3POS GOLD |
3380 | 0.00 |
ДобавитьНемедленный |
- | 8060 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | - | - | - | Solder | - | - | - | - | - | |
|
|
808-AG12DCONN IC DIP SOCKET 8POS TIN-LEAD |
2014 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
808-AG12SMCONN IC DIP SOCKET 8POS TIN-LEAD |
3928 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
816-AG12D-ESCONN IC DIP SOCKET 16POS TINLEAD |
3599 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
1-1437538-3CONN IC DIP SOCKET 28POS TINLEAD |
2211 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
832-AG11DCONN IC DIP SOCKET 32POS GOLD |
2257 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
848-AG11DCONN IC DIP SOCKET 48POS GOLD |
2652 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
848-AG11D-ESCONN IC DIP SOCKET 48POS GOLD |
2487 | 0.00 |
ДобавитьНемедленный |
Datenblatt |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
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